公开(公告)号：US06261671B1

公开(公告)日：2001-07-17

申请号：US09402475

申请日：1999-10-12

申请人： Motoo Asai ,  Yoshitaka Ono ,  Masato Kawade ,  Kouta Noda ,  Youko Nishiwaki

发明人： Motoo Asai ,  Yoshitaka Ono ,  Masato Kawade ,  Kouta Noda ,  Youko Nishiwaki

IPC分类号： B32B300

CPC分类号： H05K3/4676 ,  C23C18/1608 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1844 ,  C23C18/24 ,  C23C18/405 ,  C23C18/50 ,  C23C18/54 ,  H05K3/4673 ,  H05K2201/0212 ,  H05K2201/0269 ,  H05K2203/0773 ,  Y10S428/901 ,  Y10T428/24893 ,  Y10T428/24917

摘要： The adhesive for electroless plating which is advantageous to ensure insulation reliabilities between lines and between layers while maintaining a practical peel strength, and the printed circuit board using the adhesive are disclosed. The adhesive is formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment, in which the heat-resistant resin particles have an average particle size of not more than 1.5 &mgr;m.

摘要翻译： 公开了用于化学镀的粘合剂，其有利于确保线间和层之间的绝缘可靠性同时保持实用的剥离强度，并且使用粘合剂的印刷电路板。 粘合剂通过将可溶于酸或氧化剂的固化的耐热树脂颗粒通过固化处理分解为难溶于酸或氧化剂的未固化的耐热树脂基体而形成，其中耐热树脂颗粒的平均粒径为 不超过1.5个妈妈。

公开(公告)号：US06248428B1

公开(公告)日：2001-06-19

申请号：US09402477

申请日：1999-10-12

申请人： Motoo Asai ,  Yoshitaka Ono ,  Masato Kawade ,  Kouta Noda ,  Youko Nishiwaki

发明人： Motoo Asai ,  Yoshitaka Ono ,  Masato Kawade ,  Kouta Noda ,  Youko Nishiwaki

IPC分类号： B32B300

CPC分类号： H05K3/4661 ,  H05K3/387 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0212 ,  H05K2203/0773 ,  H05K2203/0789 ,  H05K2203/0796 ,  Y10S428/901 ,  Y10T428/24893 ,  Y10T428/24917 ,  Y10T428/2804

摘要： Adhesive adhesive for electroless plating ensures insulation reliabilities between lines and between layers while maintaining a practical peel strength, and a printed circuit board using the adhesive are disclosed. The adhesive is formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment, in which the heat-resistant resin particles have an average particle size of not more than 2 &mgr;m, and comprised of rough particles and fine particles.

摘要翻译： 用于化学镀的粘合剂粘合剂确保了线之间和层之间的绝缘可靠性，同时保持实际的剥离强度，并且公开了使用该粘合剂的印刷电路板。 粘合剂通过将可溶于酸或氧化剂的固化的耐热树脂颗粒通过固化处理分解为难溶于酸或氧化剂的未固化的耐热树脂基体而形成，其中耐热树脂颗粒的平均粒径为 不超过2毫米，由粗颗粒和细颗粒组成。