Invention Grant
US06249052B1 Substrate on chip (SOC) multiple-chip module (MCM) with chip-size-package (CSP) ready configuration
有权
片上芯片（SOC）多芯片模块（MCM），芯片尺寸封装（CSP）就绪配置
- Patent Title: Substrate on chip (SOC) multiple-chip module (MCM) with chip-size-package (CSP) ready configuration
- Patent Title (中): 片上芯片（SOC）多芯片模块（MCM），芯片尺寸封装（CSP）就绪配置
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Application No.: US09314493Application Date: 1999-05-18
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Publication No.: US06249052B1Publication Date: 2001-06-19
- Inventor: Paul T. Lin
- Applicant: Paul T. Lin
- Main IPC: H01L214763
- IPC: H01L214763
Abstract:
The present invention includes an integrated multiple-substrate-on-chip-module (MSOCM) assembly. This assembly includes a chip-size package (CSP)-ready MSOCM board having a top surface and a bottom surface. The CSP-ready MCM board includes a plurality of bonding-wire windows and the bottom surface further includes a plurality of board bonding-pads near the bonding-wire window. The assembly further includes an adhesive layer disposed on top of the CSP-ready MCM board having also having a plurality of bonding wire windows corresponding to and aligned with the bonding wire windows on the MCM board. The assembly further includes a plurality of integrated circuit (IC) chips mounted onto the adhesive layer over the top surface of the CSP-ready MCM board. Each of the IC chips is provided with a plurality of chip bonding pads facing an open space defined by the bonding wire windows. The assembly further includes a plurality of bonding wires disposed in the space defined by the bonding-wire windows and interconnected between each of the chip bonding pads and a corresponding board bonding pad disposed on the bottom surface of the CSP-ready MSOCM board.
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