发明授权
US06252264B1 Integrated circuit chip with features that facilitate a multi-chip module having a number of the chips
失效
具有促进具有多个芯片的多芯片模块的特征的集成电路芯片
- 专利标题： Integrated circuit chip with features that facilitate a multi-chip module having a number of the chips
- 专利标题（中）： 具有促进具有多个芯片的多芯片模块的特征的集成电路芯片
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申请号： US09364739申请日： 1999-07-30
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公开(公告)号： US06252264B1公开(公告)日： 2001-06-26
- 发明人: Roger Ned Bailey , Bradley McCredie , Michael Gerard Nealon , Hugh Rodney Stigdon
- 申请人： Roger Ned Bailey , Bradley McCredie , Michael Gerard Nealon , Hugh Rodney Stigdon
- 主分类号： H01L2710
- IPC分类号： H01L2710
摘要：
An integrated circuit chip has a first i/o set associated with a first edge of the chip and a second i/o set associated with a second edge of the chip. The first i/o set has a physical symmetry with respect to the second i/o set, to facilitate a number of the chips being interconnected in a ring to one another on a multi-chip module, with the chips symetrically disposed thereon. The chip has a bus interconnecting the first and second i/o sets for transmitting signals across the chip. The bus has regeneration circuitry for regenerating said signals traversing the chip.
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