发明授权
- 专利标题： Selective wafer-level testing and burn-in
- 专利标题（中）： 选择性晶圆级测试和老化
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申请号： US09236927申请日： 1999-01-25
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公开(公告)号： US06255208B1公开(公告)日： 2001-07-03
- 发明人: William Emmett Bernier , Claude Louis Bertin , Anilkumar Chinuprasad Bhatt , Michael Anthony Gaynes , Erik Leigh Hedberg , Nikhil M. Murdeshwar , Mark Vincent Pierson , William R. Tonti , Paul A. Totta , Joseph John Van Horn , Jerzy Maria Zalesinski
- 申请人： William Emmett Bernier , Claude Louis Bertin , Anilkumar Chinuprasad Bhatt , Michael Anthony Gaynes , Erik Leigh Hedberg , Nikhil M. Murdeshwar , Mark Vincent Pierson , William R. Tonti , Paul A. Totta , Joseph John Van Horn , Jerzy Maria Zalesinski
- 主分类号： H01L2144
- IPC分类号： H01L2144
摘要：
Selective electrical connections between an electronic component and a test substrate are made using an electrical conductive material. The conductive material of the present invention is a dissolvable material, allowing for rework and repair of a wafer at the wafer-level, and retesting at the wafer-level. In addition, the conductive material may also be used in a permanent package, since the conductive material of the present invention provides complete electrical conductivity and connection between the electronic component and the substrate.
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