公开(公告)号：US06255208B1

公开(公告)日：2001-07-03

申请号：US09236927

申请日：1999-01-25

申请人： William Emmett Bernier ,  Claude Louis Bertin ,  Anilkumar Chinuprasad Bhatt ,  Michael Anthony Gaynes ,  Erik Leigh Hedberg ,  Nikhil M. Murdeshwar ,  Mark Vincent Pierson ,  William R. Tonti ,  Paul A. Totta ,  Joseph John Van Horn ,  Jerzy Maria Zalesinski

发明人： William Emmett Bernier ,  Claude Louis Bertin ,  Anilkumar Chinuprasad Bhatt ,  Michael Anthony Gaynes ,  Erik Leigh Hedberg ,  Nikhil M. Murdeshwar ,  Mark Vincent Pierson ,  William R. Tonti ,  Paul A. Totta ,  Joseph John Van Horn ,  Jerzy Maria Zalesinski

IPC分类号： H01L2144

CPC分类号： H01L24/12 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/1134 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13164 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/3512

摘要： Selective electrical connections between an electronic component and a test substrate are made using an electrical conductive material. The conductive material of the present invention is a dissolvable material, allowing for rework and repair of a wafer at the wafer-level, and retesting at the wafer-level. In addition, the conductive material may also be used in a permanent package, since the conductive material of the present invention provides complete electrical conductivity and connection between the electronic component and the substrate.

摘要翻译： 使用导电材料制成电子部件和测试基板之间的选择性电连接。 本发明的导电材料是可溶解的材料，允许在晶片级对晶片进行返修和修复，并且在晶片级重新测试。 此外，由于本发明的导电材料提供完整的导电性和电子元件与基片之间的连接，导电材料也可用于永久性封装。

公开(公告)号：US06251707B1

公开(公告)日：2001-06-26

申请号：US09546567

申请日：2000-04-11

申请人： William Emmett Bernier ,  Michael Anthony Gaynes ,  Irving Memis ,  Hussain Shaukatuallah

发明人： William Emmett Bernier ,  Michael Anthony Gaynes ,  Irving Memis ,  Hussain Shaukatuallah

IPC分类号： H01L2144

CPC分类号： H01L24/31 ,  H01L21/563 ,  H01L23/367 ,  H01L23/433 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16237 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83951 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/0665 ,  H01L2924/00012

摘要： An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using an adhesive of silicone or flexible-epoxy adhesive. The aluminum may be coated by anodizing or chromate conversion or the copper may be coated with nickel or gold or chromium. Such structures are especially useful for flip chip attachment to flexible or rigid organic circuit boards or modules such as CQFP, CBGA, CCGA, CPGA, TBGA, PEGA, DCAM, MCM-L, and other chip carrier packages in which the back side of chips are connected directly to heat sinks. These adhesive materials withstand wet or dry thermal cycle tests of −65 to 1500° C. for 1,000 cycles and 85° C. and 85% relative humidity for 1000 hours while maintaining a tensile strenth of at least 500 psi. The adhesive contains materials having high thermal conductivity and a low coefficient of thermal expansion (CTE) in order to provide increased thermal performance.

摘要翻译： 使用硅树脂或柔性环氧树脂粘合剂的粘合剂将铝或铜散热器连接到陶瓷帽或裸露的半导体芯片。 可以通过阳极氧化或铬酸盐转化来涂覆铝，或者铜可以用镍或金或铬涂覆。 这种结构对于倒装芯片连接到诸如CQFP，CBGA，CCGA，CPGA，TBGA，PEGA，DCAM，MCM-L和其它芯片载体封装的柔性或刚性有机电路板或模块特别有用，其中芯片的背面 直接连接到散热片。 这些粘合剂材料可承受-65至1500℃，1000次循环，85℃和85％相对湿度下持续1000小时的湿循环或干热循环试验，同时保持至少500psi的拉伸强度。 粘合剂含有具有高导热性和低热膨胀系数（CTE）的材料，以提供增加的热性能。

公开(公告)号：US6069023A

公开(公告)日：2000-05-30

申请号：US94401

申请日：1998-06-10

申请人： William Emmett Bernier ,  Michael Anthony Gaynes ,  Irving Memis ,  Hussain Shaukatuallah

发明人： William Emmett Bernier ,  Michael Anthony Gaynes ,  Irving Memis ,  Hussain Shaukatuallah

IPC分类号： H01L23/373 ,  H01L21/44 ,  H01L21/52 ,  H01L21/56 ,  H01L21/60 ,  H01L23/34 ,  H01L23/367 ,  H01L23/433

CPC分类号： H01L24/31 ,  H01L21/563 ,  H01L23/367 ,  H01L23/433 ,  H01L2224/16237 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83951 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/3025

摘要： An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using an adhesive of silicon or flexible-epoxy adhesive. The aluminum may be coated by anodizing or Chromate conversion or the copper may be coated with nickel or gold Chromium. Such structures are especially useful for flip chip attachment to flexible or rigid organic circuit boards or modules such as CQFP, CBGA, CCGA, CPGA, TBGA, PBGA, DCAM, MCM-L, and other chip carrier packages in which the back side of chips are connected directly to heat sinks. These adhesive materials withstand wet or dry thermal cycle tests of -65 to 150.degree. C. for 1,000 cycles and 85.degree. C. and 85% relative humidity for 1000 hours while maintaining a tensile strenth of at least 500 psi. The adhesive contains materials having high thermal conductivity and a low coefficient of thermal expansion (CTE) in order to provide increased thermal performance and a CTE between that of the silicon metal die and the metal of the heat sink.

摘要翻译： 使用硅或柔性环氧树脂粘合剂的粘合剂将铝或铜散热器附接到陶瓷帽或裸露的半导体芯片。 可以通过阳极氧化或铬酸盐转化来涂覆铝，或者铜可以用镍或金铬镀覆。 这种结构对于倒装芯片连接到诸如CQFP，CBGA，CCGA，CPGA，TBGA，PBGA，DCAM，MCM-L和其他芯片载体封装的柔性或刚性有机电路板或模块特别有用，其中芯片的背面 直接连接到散热片。 这些粘合剂材料经受湿度或干热循环试验，在-65至150℃下进行1000次循环，85℃和85％相对湿度下持续1000小时，同时保持至少500psi的拉伸强度。 粘合剂包含具有高导热性和低热膨胀系数（CTE）的材料，以便提供增加的热性能和在硅金属模具和散热器的金属之间的CTE。

公开(公告)号：US5847929A

公开(公告)日：1998-12-08

申请号：US672875

申请日：1996-06-28

申请人： William Emmett Bernier ,  Michael Anthony Gaynes ,  Irving Memis ,  Hussain Shaukatuallah

发明人： William Emmett Bernier ,  Michael Anthony Gaynes ,  Irving Memis ,  Hussain Shaukatuallah

IPC分类号： H01L23/373 ,  H01L21/44 ,  H01L21/52 ,  H01L21/56 ,  H01L21/60 ,  H01L23/34 ,  H01L23/367 ,  H01L23/433 ,  H05K7/20

CPC分类号： H01L24/31 ,  H01L21/563 ,  H01L23/367 ,  H01L23/433 ,  H01L2224/16237 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83951 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/3025

摘要： An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using an adhesive of silicone or flexible-epoxy adhesive. The aluminum may be coated by anodizing or chromate conversion or the copper may be coated with nickel or gold on chromium. Such structures are especially useful for flip chip attachment to flexible or rigid organic circuit boards or modules such as CQFP, CBGA, CCGA, CPGA, TBGA, PBGA, DCAM, MCM-L, and other chip carrier packages in which the back side of chips are connected directly to heat sinks. These adhesive materials withstand wet or dry thermal cycle tests of -65.degree. to 150.degree. C. for 1,000 cycles and 85.degree. C. and 85% relative humidity for 1000 hours while maintaining a tensile strenth of at least 500 psi. The adhesive contains materials having high thermal conductivity and a low coefficient of thermal expansion (CTE) in order to provide increased thermal performance.

摘要翻译： 使用硅树脂或柔性环氧树脂粘合剂的粘合剂将铝或铜散热器连接到陶瓷帽或裸露的半导体芯片。 可以通过阳极氧化或铬酸盐转化来涂覆铝，或者可以在铬上涂覆镍或金。 这种结构对于倒装芯片连接到诸如CQFP，CBGA，CCGA，CPGA，TBGA，PBGA，DCAM，MCM-L和其他芯片载体封装的柔性或刚性有机电路板或模块特别有用，其中芯片的背面 直接连接到散热片。 这些粘合剂材料经受湿润或干热循环试验，在-65至150℃下进行1000次循环，85℃和85％相对湿度下持续1000小时，同时保持至少500psi的拉伸强度。 粘合剂含有具有高导热性和低热膨胀系数（CTE）的材料，以提供增加的热性能。