A testing means for holding chips to perform tests comprises of a plurality of inner leads for providing electrical connection for the chips with a plurality of conductive bumps. A metal layer is formed on surfaces of the plurality of inner leads for fixing the chips on the plurality of inner leads, wherein a melting point of the metal layer is below a melting point of the conductive bumps. Then, a adhesive material is pasted on a bottom surface of the plurality of inner leads for fixing the plurality of inner leads. A holding means is used to connect and hold the plurality of inner leads, and used for providing electrical connection for the plurality of inner leads.