A structure and method for mounting a processor assembly on a mother board and a structure and method for cooling the processor assembly are described. The processor assembly includes a processor circuit board assembly which is located adjacent to a heat sink for removing heat from the circuit board assembly. The heat sink and circuit board assembly are maintained in an upright position with respect to the mother board by a fame mounted on the mother board and/or the computer system chassis. A cover mounted to the top of the frame holds a connector on the processor circuit board assembly in mating contact with a connector on the mother board. The cover also serves to complete an enclosure around the heat sink and processor circuit board assembly. Fans mounted to the frame move air from an intake end of the processor assembly, across cooling fins on the heat sink, to an outlet end of the processor assembly such that a ducted cooling system is provided for the processor assembly.