发明授权
US06261863B1 Components with releasable leads and methods of making releasable leads
有权
具有可释放引线的部件和制造可释放引线的方法
- 专利标题： Components with releasable leads and methods of making releasable leads
- 专利标题（中）： 具有可释放引线的部件和制造可释放引线的方法
-
申请号： US09471973申请日： 1999-12-23
-
公开(公告)号： US06261863B1公开(公告)日： 2001-07-17
- 发明人: Masud Beroz , Thomas H. DiStefano , Anthony B. Faraci , Joseph Fjelstad , Belgacem Haba
- 申请人： Masud Beroz , Thomas H. DiStefano , Anthony B. Faraci , Joseph Fjelstad , Belgacem Haba
- 主分类号： H01L2144
- IPC分类号： H01L2144
摘要：
A connection component for a microelectronic device such as a semiconductor chip incorporates a support layer and conductive structures extending across a surface of the support layer. The conductive structures have anchors connecting them to the support layer, and releasable or unanchored portions. A method of making a connection component includes removing material from the conductive structures or the support layer or both to form the anchors.
信息查询
