公开(公告)号：US20160037623A1

公开(公告)日：2016-02-04

申请号：US13573309

申请日：2012-09-07

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/18

CPC classification number: H05K1/148 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/24137 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2924/15153 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1579 ,  H05K1/0203 ,  H05K1/0283 ,  H05K1/185 ,  H05K3/0044 ,  H05K3/445 ,  H05K3/4691 ,  H05K2201/055 ,  H05K2201/09745 ,  H05K2203/1469

Abstract: A rigid flex circuit comprised of high thermal conductivity sections, said sections having components disposed so as to have their contacts substantially planar with the surface of the thermally conductive section and wherein the contacts are interconnected directly to the traces without the use of solder and further having the thermally conductive sections interconnected to one another by means of flexible circuit sections.

Abstract translation: 一种由高导热部分组成的刚性柔性电路，所述部分具有设置成使其触点与导热部分的表面基本平面的部件，并且其中触头直接与迹线互连而不使用焊料并进一步具有 导热部分通过柔性电路部分彼此互连。

公开(公告)号：US08148205B2

公开(公告)日：2012-04-03

申请号：US12894732

申请日：2010-09-30

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H01L21/00

CPC classification number: H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L2224/11 ,  H01L2224/11003 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49126 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A method of making a microelectronic connection component is disclosed. A plurality of portions of a conductive, etch-resistant material is provided on a surface of a metallic sheet. The sheet is etched from the surface to form posts extending generally parallel to one another aligned with the portions of the etch-resistant material. A microelectronic device is provided having one of a front face or a rear face overlying first ends of the posts. Second ends of the posts remote from the first ends face away from the microelectronic device as interconnection terminals for the connection component. At least some of the posts are electrically connected to the microelectronic device.

Abstract translation: 公开了一种制造微电子连接部件的方法。 导电耐腐蚀材料的多个部分设置在金属片的表面上。 从表面蚀刻片材以形成大致平行于彼此与抗蚀刻材料的部分对准的柱。 提供了一个微电子器件，其具有覆盖在柱的第一端上的前表面或后表面之一。 远离第一端的柱的第二端作为用于连接部件的互连端子远离微电子器件。 至少一些柱电连接到微电子器件。

公开(公告)号：US07872344B2

公开(公告)日：2011-01-18

申请号：US11474199

申请日：2006-06-23

Applicant: Joseph Fjelstad ,  Konstantine Karavakis

Inventor： Joseph Fjelstad ,  Konstantine Karavakis

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H01L23/3114 ,  H01L23/3121 ,  H01L23/4951 ,  H01L23/498 ,  H01L23/525 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/72 ,  H01L24/82 ,  H01L24/94 ,  H01L2224/0231 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2224/24011 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/274 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/85424 ,  H01L2924/00011 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/48824 ,  H01L2924/00 ,  H01L2924/01004

Abstract: A compliant semiconductor chip package assembly includes a a semiconductor chip having a plurality of chip contacts, and a compliant layer having a top surface, a bottom surface and sloping peripheral edges, whereby the bottom surface of the compliant layer overlies a surface of the semiconductor chip. The assembly also includes a plurality of electrically conductive traces connected to the chip contacts of the semiconductor chip, the traces extending along the sloping edges to the top surface of the compliant layer. The assembly may include conductive terminals overlying the semiconductor chip, with the compliant layer supporting the conductive terminals over the semiconductor chip. The conductive traces have first ends electrically connected with the contacts of the semiconductor chip and second ends electrically connected with the conductive terminals. The conductive terminals are movable relative to the semiconductor chip.

Abstract translation: 兼容的半导体芯片封装组件包括具有多个芯片触点的半导体芯片和具有顶表面，底表面和倾斜周边边缘的柔性层，由此柔性层的底表面覆盖在半导体芯片的表面上。 组件还包括连接到半导体芯片的芯片触点的多个导电迹线，迹线沿倾斜边缘延伸到柔性层的顶表面。 组件可以包括覆盖半导体芯片的导电端子，其中柔性层将导电端子支撑在半导体芯片上。 导电迹线具有与半导体芯片的触点电连接的第一端和与导电端子电连接的第二端。 导电端子可相对于半导体芯片移动。

公开(公告)号：US07531894B2

公开(公告)日：2009-05-12

申请号：US11257296

申请日：2005-10-24

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H01L21/44

CPC classification number: H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L2224/11 ,  H01L2224/11003 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49126 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A method of electrically connecting a microelectronic component having a first surface bearing a plurality of contacts. The method including the steps of forming a subassembly by juxtaposing a connection component having a support structure and a plurality of elongated posts extending substantially parallel to one another from a first surface of the support structure with the microelectronic component so that the support structure overlies the surface of the component with the posts extending away from the component and electrically connecting the posts to the contacts of the microelectronic component.

Abstract translation: 电连接具有带有多个触点的第一表面的微电子部件的方法。 该方法包括以下步骤：通过将具有支撑结构的连接部件和由支撑结构的第一表面基本上彼此平行延伸的多个细长柱与微电子部件并置而形成子组件，使得支撑结构覆盖在表面 所述部件的柱子远离所述部件并且将所述柱电连接到所述微电子部件的触头。

公开(公告)号：US07408260B2

公开(公告)日：2008-08-05

申请号：US11487263

申请日：2006-07-14

Applicant: Joseph Fjelstad ,  Konstantine Karavakis

Inventor： Joseph Fjelstad ,  Konstantine Karavakis

IPC: H01L29/40 ,  H01L23/48

CPC classification number: H01L23/3114 ,  H01L23/3121 ,  H01L23/4951 ,  H01L23/498 ,  H01L23/525 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/72 ,  H01L24/82 ,  H01L24/94 ,  H01L2224/0231 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2224/24011 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/274 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/85424 ,  H01L2924/00011 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/48824 ,  H01L2924/00 ,  H01L2924/01004

Abstract: A microelectronic assembly includes a microelectronic element such as a semiconductor chip or wafer having a first surface and contacts accessible at the first surface, a compliant layer overlying the first surface of the microelectronic element, and conductive protrusions overlying the compliant layer and projecting away from the first surface of the microelectronic element, wherein the conductive protrusions are electrically interconnected with the contacts of the microelectronic element. The conductive protrusions are movable relative to said microelectronic element.

Abstract translation: 微电子组件包括微电子元件，例如具有第一表面和在第一表面可接触的触点的半导体芯片或晶片的微电子元件，覆盖微电子元件的第一表面的柔性层和覆盖柔顺层的导电突起并远离 微电子元件的第一表面，其中导电突起与微电子元件的触点电互连。 导电突起可相对于所述微电子元件移动。

公开(公告)号：US07176580B1

公开(公告)日：2007-02-13

申请号：US10973172

申请日：2004-10-25

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H01L23/08 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/85 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/48482 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85375 ,  H01L2224/85815 ,  H01L2224/8585 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: Disclosed are structures and methods that facilitate the use of wire bonding technology over active areas of an IC chip. The invention is also suitable for use with IC structures that use brittle dielectric materials such as low K dielectrics.

Abstract translation: 公开了有助于在IC芯片的有效区域使用引线键合技术的结构和方法。 本发明也适用于使用诸如低K电介质的脆性介电材料的IC结构。

公开(公告)号：US20060261476A1

公开(公告)日：2006-11-23

申请号：US11487263

申请日：2006-07-14

Applicant: Joseph Fjelstad ,  Konstantine Karavakis

Inventor： Joseph Fjelstad ,  Konstantine Karavakis

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H01L23/3114 ,  H01L23/3121 ,  H01L23/4951 ,  H01L23/498 ,  H01L23/525 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/72 ,  H01L24/82 ,  H01L24/94 ,  H01L2224/0231 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2224/24011 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/274 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/85424 ,  H01L2924/00011 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/48824 ,  H01L2924/00 ,  H01L2924/01004

Abstract: A microelectronic assembly includes a microelectronic element such as a semiconductor chip or wafer having a first surface and contacts accessible at the first surface, a compliant layer overlying the first surface of the microelectronic element, and conductive protrusions overlying the compliant layer and projecting away from the first surface of the microelectronic element, wherein the conductive protrusions are electrically interconnected with the contacts of the microelectronic element. The conductive protrusions are movable relative to said microelectronic element.

Abstract translation: 微电子组件包括微电子元件，例如具有第一表面和在第一表面可接触的触点的半导体芯片或晶片的微电子元件，覆盖微电子元件的第一表面的柔性层和覆盖柔顺层的导电突起并远离 微电子元件的第一表面，其中导电突起与微电子元件的触点电互连。 导电突起可相对于所述微电子元件移动。

公开(公告)号：US07067742B2

公开(公告)日：2006-06-27

申请号：US10033988

申请日：2001-12-28

Applicant: Thomas H. DiStefano ,  Joseph Fjelstad ,  Belgacem Haba ,  Owais Jamil ,  Konstantine Karavakis ,  David Light ,  John W. Smith

Inventor： Thomas H. DiStefano ,  Joseph Fjelstad ,  Belgacem Haba ,  Owais Jamil ,  Konstantine Karavakis ,  David Light ,  John W. Smith

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H05K3/4092 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00

Abstract: A connection component for use in making microelectronic element assemblies which has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support structure. When the releasable end of the lead is bonded to a contact on a semiconductor chip, the releasable end of the lead can be peeled from the support structure such that the chip may be moved away from the support structure. A compliant layer may be disposed between the chip and the support structure. If a compliant material is injected between the chip and the support structure to form the compliant layer, the compliant material will lift the chip away from the support structure and facilitate the peeling of the leads from the support structure.

公开(公告)号：US20050239300A1

公开(公告)日：2005-10-27

申请号：US11055579

申请日：2005-02-09

Applicant: Gary Yasumura ,  Joseph Fjelstad ,  William Wiedemann ,  Para Segaram ,  Kevin Grundy

Inventor： Gary Yasumura ,  Joseph Fjelstad ,  William Wiedemann ,  Para Segaram ,  Kevin Grundy

IPC: H01R12/00 ,  H01R12/16

CPC classification number: H05K1/117 ,  H01R12/523 ,  H01R12/62 ,  H01R12/716 ,  H01R13/24 ,  H01R13/6587 ,  H05K1/142 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/09063 ,  H05K2201/09445 ,  H05K2201/09472 ,  H05K2201/09709 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2203/167

Abstract: An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised of stair-step electrical connectors mated to stair-step printed circuit boards, other stair-step electrical components, or combinations thereof.

Abstract translation: 一种电连接器，包括布置成阶梯式结构的多个电触点，其设计成与具有以阶梯状构造布置的电触点的电气部件配合。 一种直接连接信号系统，包括与台阶式印刷电路板，其他楼梯电气部件或其组合配合的楼梯级电连接器。

公开(公告)号：US20050189640A1

公开(公告)日：2005-09-01

申请号：US11055578

申请日：2005-02-09

Applicant: Kevin Grundy ,  Joseph Fjelstad ,  Gary Yasumura ,  William Wiedemann ,  Para Segaram

Inventor： Kevin Grundy ,  Joseph Fjelstad ,  Gary Yasumura ,  William Wiedemann ,  Para Segaram

IPC: H01L23/02 ,  H01L23/13 ,  H01L23/31 ,  H01L25/10 ,  H05K1/18 ,  H05K3/40

CPC classification number: H01L23/13 ,  H01L23/3107 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16235 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/85399 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/182 ,  H05K1/183 ,  H05K3/308 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/4046 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/0919 ,  H05K2201/092 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/1053 ,  H05K2201/10545 ,  H05K2201/1059 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10727 ,  H05K2201/10734 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Structures employed by a plurality of packages, printed circuit boards, connectors and interposers to create signal paths which reduce the deleterious signal quality issues associated with the use of through-holes. Disclosed structures can coexist with through-hole implementations.

Abstract translation: 由多个封装，印刷电路板，连接器和插入件采用的结构，以产生减少与使用通孔相关联的有害信号质量问题的信号路径。 公开的结构可以与通孔实现共存。