发明授权
US06265017B1 Method and control system for applying solder flux to a printed circuit
失效
将焊剂焊接到印刷电路的方法和控制系统
- 专利标题： Method and control system for applying solder flux to a printed circuit
- 专利标题（中）： 将焊剂焊接到印刷电路的方法和控制系统
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申请号： US09375131申请日： 1999-08-16
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公开(公告)号： US06265017B1公开(公告)日： 2001-07-24
- 发明人: Patrick T. Hogan , Kenneth Zalewski , John P. Byers , James Powell , Drew Roberts , Richard G. Christyson
- 申请人： Patrick T. Hogan , Kenneth Zalewski , John P. Byers , James Powell , Drew Roberts , Richard G. Christyson
- 主分类号： B05D102
- IPC分类号： B05D102
摘要：
A first embodiment includes a control system which operates a spray gun to apply an even coating of flux to a circuit board or a plurality of different length circuit boards irrespective of the speed that the circuit board(s) move through a coating chamber. In a second embodiment, the control system pulses the spray gun on and off with a pulsing pattern that coats a plurality of zones of a circuit board with spray patterns of different length and thickness.
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