By providing an area where an Au film 28b is removed and a Ti film 28a is exposed along the plane tangent to the side where the p-n junction of a semiconductor chip is exposed, sticking of the Au film 28b to the chip side or protruding of the film as a flash from the side is prevented, which normally provides a starting place for creep of a solder 42 on the chip side, which in turn causes p-n junction short-circuiting when dividing of chips.