发明授权
US06274465B1 DC electric field assisted anneal 失效
直流电场辅助退火

DC electric field assisted anneal
摘要:
A method for forming a desired junction profile in a semiconductor device. At least one dopant is introduced into a semiconductor substrate. The at least one dopant is diffused in the semiconductor substrate through annealing the semiconductor substrate and the at least one dopant while simultaneously exposing the semiconductor substrate to a DC electric field.
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