Ceramic powder (50) may be disposed within a flexible mold (30 and 130) to form a dense ceramic wafer (60) by hydrostatic pressing. The ceramic powder (50) may include various types of pyroelectric material or bolometric material. One or more substrates (20 and 24) may be disposed within the flexible mold (30 and 130) to form the desired dense ceramic wafer (60). The flexible mold (30 and 130) may be placed in one or more vacuum sealed bags (38) prior to hydrostatic pressing. Also, a vibration table (70) may be used to minimize any void spaces in the ceramic powder (50) prior to hydrostatic pressing.