Methods of fabrication of ceramic wafers
    1.
    发明授权
    Methods of fabrication of ceramic wafers 失效
    陶瓷晶片的制造方法

    公开(公告)号:US06280662B1

    公开(公告)日:2001-08-28

    申请号:US08474566

    申请日:1995-06-07

    IPC分类号: B29C6724

    摘要: Ceramic powder (50) may be disposed within a flexible mold (30 and 130) to form a dense ceramic wafer (60) by hydrostatic pressing. The ceramic powder (50) may include various types of pyroelectric material or bolometric material. One or more substrates (20 and 24) may be disposed within the flexible mold (30 and 130) to form the desired dense ceramic wafer (60). The flexible mold (30 and 130) may be placed in one or more vacuum sealed bags (38) prior to hydrostatic pressing. Also, a vibration table (70) may be used to minimize any void spaces in the ceramic powder (50) prior to hydrostatic pressing.

    摘要翻译: 陶瓷粉末(50)可以设置在柔性模具(30和130)内,以通过静水压力形成致密的陶瓷晶片(60)。 陶瓷粉末(50)可以包括各种类型的热电材料或者辐射材料。 一个或多个基材(20和24)可以设置在柔性模具(30和130)内以形成所需的致密陶瓷晶片(60)。 柔性模具(30和130)可以在静液压之前被放置在一个或多个真空密封袋(38)中。 此外,振动台(70)可以用于在静液压之前使陶瓷粉末(50)中的任何空隙空间最小化。