- 专利标题: Method of manufacturing a semiconductor device
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申请号: US09004779申请日: 1998-01-09
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公开(公告)号: US06281057B1公开(公告)日: 2001-08-28
- 发明人: Yoichiro Aya , Tomoyuki Nouda , Yasuo Nakahara , Naoya Sotani , Hisashi Abe , Hiroki Hamada
- 申请人: Yoichiro Aya , Tomoyuki Nouda , Yasuo Nakahara , Naoya Sotani , Hisashi Abe , Hiroki Hamada
- 优先权: JP9-002450 19970109; JP9-072279 19970325; JP9-080221 19970331; JP9-164644 19970620; JP9-345084 19971215
- 主分类号: H01L2184
- IPC分类号: H01L2184
摘要:
A method is obtained of manufacturing a semiconductor device including a semiconductor layer with high field-effect mobility. According to the semiconductor device manufacturing method, a semiconductor layer is formed on a substrate and then the semiconductor layer is irradiated with high energy beam. Then, a heat treatment is provided under a temperature condition capable of reducing the surface roughness of the semiconductor layer. The radiation of high energy beam toward the semiconductor layer improves the crystalinity of the semiconductor layer and the subsequent heat treatment reduces the surface roughness of the semiconductor layer to enhance the field-effect mobility of the semiconductor layer.
公开/授权文献
- US20010003659A1 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE 公开/授权日:2001-06-14
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