发明授权
- 专利标题： Low cost ball grid array package
- 专利标题（中）： 低成本球栅阵列封装
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申请号： US09346100申请日： 1999-07-01
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公开(公告)号： US06282100B1公开(公告)日： 2001-08-28
- 发明人: Yinon Degani , Thomas Dixon Dudderar , Robert Charles Frye
- 申请人： Yinon Degani , Thomas Dixon Dudderar , Robert Charles Frye
- 主分类号： H05K118
- IPC分类号： H05K118
摘要：
The specification describes a high density I/O IC package in which the IC chip is bonded to a silicon intermediate interconnection substrate (IIS), and the IIS is wire bonded to a printed wiring board. This marriage of wire bond technology with high density I/O IC chips results in a low cost, high reliability, state of the art IC package.
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