发明授权
US06284080B1 Barrier metallization in ceramic substrate for implantable medical devices 失效
用于可植入医疗器械的陶瓷衬底中的阻挡金属化

Barrier metallization in ceramic substrate for implantable medical devices
摘要:
The present invention relates to multi-layer ceramic packaging of hybrid micro-electronic devices, including those for implantable medical devices. The invention permits size reduction and design simplification in such packaging by eliminating the need for electrolytic or electroless plating, and by eliminating or substantially eliminating the shrinkage variation typically associated with surface metallization techniques.
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