公开(公告)号：US06776862B2

公开(公告)日：2004-08-17

申请号：US09942461

申请日：2001-08-29

申请人： Sadaaki Sakamoto

发明人： Sadaaki Sakamoto

IPC分类号： B32B3126

CPC分类号： B32B18/00 ,  C04B2235/6567 ,  C04B2237/341 ,  C04B2237/343 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A method for fabricating a multilayered ceramic board includes forming a green laminate, the green laminate including a plurality of green base layers containing a low-temperature sinterable ceramic material which is a ceramic powder and a glass component, and a binder; at least one green constraining layer disposed in contact with a principal surface of a specific green base layer, the green constraining layer containing an inorganic material powder which is not sintered at the sintering temperature of the low-temperature sinterable ceramic material; and wiring conductors; and firing the green laminate at the sintering temperature of the low-temperature sinterable ceramic material. The firing step includes a binder removal step and a sintering step for obtaining the sintered state of the low-temperature sinterable ceramic material in which the ceramic powder is densified while the glass component is fluidized. The rate of temperature increase from the binder removal step to the sintering step is set to be more than about ° C./minute.

摘要翻译： 一种多层陶瓷板的制造方法，其特征在于，具备生坯层叠体，所述生坯层叠体包含多个含有陶瓷粉末和玻璃成分的低温可烧结陶瓷材料的绿色基底层和粘合剂; 至少一个与特定绿色基底层的主表面接触的绿色约束层，所述绿色约束层含有在所述低温可烧结陶瓷材料的烧结温度下未烧结的无机材料粉末; 和布线导体; 并在低温可烧结陶瓷材料的烧结温度下焙烧生坯层压体。 焙烧步骤包括粘合剂去除步骤和烧结步骤，用于获得当玻璃组分流化时陶瓷粉末致密化的低温可烧结陶瓷材料的烧结状态。 从粘合剂去除步骤到烧结步骤的温度升高速率设定为大于约℃/分钟。

公开(公告)号：US06764565B2

公开(公告)日：2004-07-20

申请号：US10320395

申请日：2002-12-17

申请人： Jyh-Chen Chen ,  Gwo-Jiun Sheu

发明人： Jyh-Chen Chen ,  Gwo-Jiun Sheu

IPC分类号： B32B3126

CPC分类号： C04B35/19 ,  C04B35/64 ,  C04B2235/3203 ,  C04B2235/3217 ,  C04B2235/9607

摘要： A method of producing lithium aluminosilicate (LAS) ceramics, which uses a mixing powder of lithium carbonate, aluminum oxide, and silicon oxide as a raw material powder. After being mixed by ball milling and baked dry, the raw material powder is processed with a calcinations process such that the raw material powder becomes a precursor. The precursor is then pressed into the green ceramic. Significantly, the high heat conducting metal sheets are tightly attached above and below the surfaces of the ceramic during sinter and heat-treatment processes. A solid-state sinter process is performed with the green ceramic. Next, the ceramic is treated with a proper heat-treatment process. Since the top and bottom surfaces of the ceramic are capped with the high heat conducting metal, the ceramics are uniformly heated during all the heating processes. The ceramics of this invention exhibit more uniform properties and stable structure, which allow them to be used as temperature compensation components and athermal products.

摘要翻译： 使用碳酸锂，氧化铝和氧化硅的混合粉末作为原料粉末的铝硅酸锂（LAS）陶瓷的制造方法。 通过球磨和烘干混合后，将原料粉末用原料粉末成为前体的煅烧方法进行处理。 然后将前体压入绿色陶瓷。 重要的是，在烧结和热处理过程中，高导热金属片紧紧地附着在陶瓷的表面之上和之下。 用绿色陶瓷进行固态烧结工艺。 接下来，用适当的热处理工艺处理陶瓷。 由于陶瓷的顶部和底部表面被高导热金属覆盖，因此在所有加热过程中均匀地加热陶瓷。 本发明的陶瓷表现出更均匀的性能和稳定的结构，这使得它们可以用作温度补偿组分和非热产物。

公开(公告)号：US06685793B2

公开(公告)日：2004-02-03

申请号：US09862125

申请日：2001-05-21

申请人： Naiyong Jing

发明人： Naiyong Jing

IPC分类号： B32B3126

CPC分类号： C08J5/12 ,  C08J2327/12 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31649 ,  Y10T428/31667 ,  Y10T428/31699

摘要： A multi-layer structure includes a layer of a fluoropolymer bonded to a substrate. The structure is prepared by exposing a bonding composition to actinic radiation, such as ultraviolet radiation, to form the bond. The bonding composition includes a light-absorbing electron donor.

摘要翻译： 多层结构包括与基底结合的氟聚合物层。 通过将结合组合物暴露于光化辐射如紫外线辐射来形成结构来制备结构。 粘合组合物包括光吸收电子给体。

公开(公告)号：US06682621B2

公开(公告)日：2004-01-27

申请号：US09932941

申请日：2001-08-21

申请人： Yoshihiko Takano ,  Takeshi Hatano ,  Akira Ishii ,  Syunichi Arisawa ,  Kazumasa Togano

发明人： Yoshihiko Takano ,  Takeshi Hatano ,  Akira Ishii ,  Syunichi Arisawa ,  Kazumasa Togano

IPC分类号： B32B3126

CPC分类号： H01L39/2496

摘要： A method of forming a novel high temperature superconducting Josephson junction which is capable of achieving a formation of a Josephson junction having high characteristic conveniently and quickly without necessitating costly micromachining facilities. Two high temperature superconducting whisker crystals are crossed with each other on a substrate and subjected to thermal treatment to form a Josephson junction between the two high temperature superconducting whisker crystals.

摘要翻译： 形成新颖的高温超导约瑟夫逊结的方法，其能够方便快捷地实现具有高特征的约瑟夫逊结的形成，而不需要昂贵的微加工设备。 两个高温超导晶须晶体在基片上相互交叉并进行热处理，以在两个高温超导晶须晶体之间形成约瑟夫逊结。

公开(公告)号：US06521083B1

公开(公告)日：2003-02-18

申请号：US09422053

申请日：1999-10-20

申请人： Douglas R. Swanson ,  David E. Nestell ,  Niall R. Lynam

发明人： Douglas R. Swanson ,  David E. Nestell ,  Niall R. Lynam

IPC分类号： B32B3126

CPC分类号： B60J10/70 ,  B29C65/14 ,  B29C65/1416 ,  B29C65/1422 ,  B29C65/1432 ,  B29C65/1445 ,  B29C65/1464 ,  B29C65/1467 ,  B29C65/1496 ,  B29C65/4835 ,  B29C65/484 ,  B29C66/80 ,  B29C66/91411 ,  B29C66/91423 ,  B29C66/91431 ,  B29C66/91645 ,  B29C66/919 ,  B29C66/91921 ,  B29C66/949 ,  B29C2035/0822 ,  B60J10/45 ,  Y10T156/17

摘要： A method of and apparatus for activating a ready-to-install heat activated adhesive for attaching a vehicle panel to a vehicle is disclosed which provides a “ready-to-install” panel assembly. The panel assembly includes first and second spaced apart surfaces, with the bead of heat activated adhesive provided on the second surface of the panel. The panel and bead are heated preferably by applying shortwave and longwave infrared radiation, with the shortwave infrared radiation being applied to an adhesive free side of the panel to heat the panel and, thereby, indirectly heat the bead of the heat activated adhesive. For example, where the window panel is such as a laminated windshield or side window or backlite comprising two glass sheets laminated with a polymer inner layer, such as plasticized polyvinyl butyral, or silicone or the like, it is preferable that the heat activation temperature of the adhesive be less than or equal to about 125° C., more preferably less than or equal to about 115° C., and most preferably less than or equal to about 105° C. Also, when a ready-to-install adhesive is applied on or adjacent to a gasket such as a polyvinyl chloride (PVC) molding, a urethane molding, or the like, it is preferable that the heat activation temperature of the adhesive be about less than or equal to about 125° C., more preferably less than or equal to about 115° C., and most preferably less than or equal to about 105° C. The longwave infrared radiation is applied to the adhesive side of the panel to directly heat the bead and thereby activate the adhesive. The apparatus includes a first heating component and a second heating component, with the first heating component including a source of shortwave infrared radiation, such as one or more lamps, which is adapted to heat the adhesive free side of the panel for indirectly heating the bead of adhesive. The second heating component includes a source of longwave radiation, for example a quartz emitter, which is applied the second side of the panel to directly heat the bead of adhesive.

公开(公告)号：US06485591B1

公开(公告)日：2002-11-26

申请号：US08286098

申请日：1994-08-04

申请人： Keiichi Nakao ,  Hideyuki Okinaka ,  Yasutaka Horibe ,  Hikoji Okuyama ,  Masahiro Katoh ,  Takashi Iguchi ,  Akira Ohmi ,  Yoshiyuki Miura

发明人： Keiichi Nakao ,  Hideyuki Okinaka ,  Yasutaka Horibe ,  Hikoji Okuyama ,  Masahiro Katoh ,  Takashi Iguchi ,  Akira Ohmi ,  Yoshiyuki Miura

IPC分类号： B32B3126

CPC分类号： B28B19/0015 ,  C04B41/4511 ,  C04B41/5194 ,  C04B2111/00844 ,  H01C7/10 ,  H01G4/308 ,  H01L41/273 ,  H01L41/297 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  C04B41/4578

摘要： The invention relates to a method of laminating ceramic greenware sheets with electrodes embedded therein (25) which is formed on a support by pressure-adhering a ceramic greenware sheet with an electrode embedded therein onto a second ceramic greenware sheet or other electrodes (23), then peeling off the support alone and transferring the ceramic greenware sheet with the embedded electrodes onto the second ceramic greenware sheet or the other electrodes. This manufacturing method enables it to laminate ceramic greenware sheets each the thickness of which is as thin as 20 micrometers or less, while maintaining their mechanical strength and embedded electrodes in the ceramic greenware sheets, thereby enabling it to prevent a occurrence of surface irregularities due to the thickness of the electrodes even when laminating to a high degree.

摘要翻译： 本发明涉及一种层压陶瓷生态餐具的方法，其中嵌入有电极（25），其通过将陶瓷生态餐具片材与其中嵌入的电极压粘在第二陶瓷绿色餐具片或其它电极上而形成在支撑体上（23） 然后单独剥离载体，并将具有嵌入电极的陶瓷生坯片材转移到第二陶瓷生态餐具片或其它电极上。 该制造方法能够将厚度为20μm以下的陶瓷生态餐具层叠，同时将其机械强度和嵌入电极保持在陶瓷绿色餐具片中，从而能够防止由于 电极的厚度即使在高度层压时也是如此。

公开(公告)号：US06413353B2

公开(公告)日：2002-07-02

申请号：US09241238

申请日：1999-02-01

申请人： Frank Louis Pompeo ,  Alain A. Caron ,  Jeffrey Thomas Coffin ,  Jeffrey Allen Zitz

发明人： Frank Louis Pompeo ,  Alain A. Caron ,  Jeffrey Thomas Coffin ,  Jeffrey Allen Zitz

IPC分类号： B32B3126

CPC分类号： C09J5/06 ,  C08L83/06 ,  C09J183/04 ,  C09J2483/00 ,  H01L23/3737 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2924/00

摘要： A semiconductor chip module uses a silicone adhesive between the semiconductor chip and a cap, said adhesive having sufficient bond strength to secure said cap to said chip without additional mechanical constraint while providing a direct thermally conductive path and permitting sufficient heat flow from said chip to said cap to maintain steady state operation of said semiconductor chip. The preferred silicone adhesive comprises a primerless, two-part polysiloxane-based adhesive made by reacting polydimethyl siloxane, an organosilicon compound, a polysiloxane, and a silane, in the presence of a catalyst.

摘要翻译： 半导体芯片模块在半导体芯片和盖子之间使用硅氧烷粘合剂，所述粘合剂具有足够的粘合强度，以在没有额外的机械约束的情况下将所述盖固定到所述芯片，同时提供直接导热路径并且允许从所述芯片到所述芯片的足够的热流 以保持所述半导体芯片的稳态运行。 优选的硅氧烷粘合剂包括在催化剂存在下通过聚二甲基硅氧烷，有机硅化合物，聚硅氧烷和硅烷反应制备的无底漆的两部分聚硅氧烷基粘合剂。

公开(公告)号：US06379485B1

公开(公告)日：2002-04-30

申请号：US09058069

申请日：1998-04-09

申请人： Brian P. Borglum

发明人： Brian P. Borglum

IPC分类号： B32B3126

CPC分类号： H01M4/8626 ,  B28B1/002 ,  B28B11/006 ,  H01M8/1231 ,  H01M2004/8689 ,  H01M2008/1293 ,  H01M2300/0074 ,  Y02P70/56

摘要： A method of manufacturing closed end ceramic fuel cell tubes with improved properties and higher manufacturing yield is disclosed. The method involves bonding an unfired cap to a hollow unfired tube to form a compound joint. The assembly is then fired to net shape without subsequent machining. The resultant closed end tube is superior in that it provides a leak-tight seal and its porosity is substantially identical to that of the tube wall. The higher manufacturing yield associated with the present method decreases overall fuel cell cost significantly.

摘要翻译： 公开了一种具有改进性能和更高制造成品率的封闭端陶瓷燃料电池管的制造方法。 该方法包括将未烧制的帽粘合到中空未燃管以形成复合接头。 然后将组件烧制成网状，无需后续加工。 所得的封闭端管的优点在于其提供了密封密封，并且其孔隙度基本上与管壁相同。 与本方法相关的较高的制造产率显着降低了总体燃料电池成本。

公开(公告)号：US06319343B1

公开(公告)日：2001-11-20

申请号：US08712240

申请日：1996-09-11

申请人： Cynthia N. Felisberto ,  Stephen A. Milkovich ,  Robert Wolff Nufer

发明人： Cynthia N. Felisberto ,  Stephen A. Milkovich ,  Robert Wolff Nufer

IPC分类号： B32B3126

CPC分类号： C04B35/111 ,  C04B35/63472 ,  Y10S428/901 ,  Y10T29/49163 ,  Y10T156/1075 ,  Y10T428/24917 ,  Y10T428/24926

摘要： Ceramic green sheets of controlled microporosity and method of making same have been provided. Controlled microporosity is achieved by including certain ionic species in the ceramic composition, particularly boron, phosphorus and copper oxide.

摘要翻译： 提供了可控微孔的陶瓷生片及其制造方法。 通过在陶瓷组合物中包括某些离子物质，特别是硼，磷和氧化铜来实现受控微孔。

公开(公告)号：US06315856B1

公开(公告)日：2001-11-13

申请号：US09271912

申请日：1999-03-18

申请人： Satoru Asagiri ,  Masayoshi Yamaguchi

发明人： Satoru Asagiri ,  Masayoshi Yamaguchi

IPC分类号： B32B3126

CPC分类号： H05K3/323 ,  H05K3/1216 ,  H05K3/125 ,  H05K3/321 ,  H05K2201/0125 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/10689 ,  H05K2203/0126 ,  H05K2203/013 ,  Y10T29/4913

摘要： In a method of mounting an electronic component by connecting leads of an electronic component and electrodes on a printed circuit board using isotropic conductive adhesive comprising a resin-based binder mixed with filler, the isotropic conductive adhesive is supplied to the electrodes on the printed circuit board by an ink jet type adhesive coating device. Also, in a method of mounting an electronic component by connecting leads of an electronic component and electrodes on a printed circuit board using isotropic conductive adhesive comprising conductive high polymer material, the isotropic conductive adhesive is supplied to the electrodes on the printed circuit board by an ink jet adhesive coating device. Also, in a method of mounting an electronic component by connecting leads of an electronic component and electrodes on a printed circuit board using anisotropic conductive adhesive comprising a resin-based binder mixed with filler, the electronic component is mounted on the printed circuit board using the anisotropic conductive adhesive which shrinks and cures by heating so as to electrically and mechanically connect the leads and electrodes.

摘要翻译： 在使用包含与填料混合的树脂类粘合剂的各向同性导电粘合剂将电子部件和电极的引线连接在印刷电路板上的电子部件的安装方法中，将各向同性导电性粘合剂供给到印刷电路板上的电极 通过喷墨式粘合剂涂布装置。 另外，在使用各向同性导电性粘合剂包含导电性高分子材料的情况下，通过将电子部件和电极的引线连接在印刷电路板上而安装电子部件的方法中，各向同性导电性粘合剂通过印刷电路板上的电极供给 喷墨粘合剂涂布装置。 此外，在使用包含与填料混合的树脂类粘合剂的各向异性导电粘合剂将电子部件和电极的引线连接在印刷电路板上的电子部件的安装方法中，电子部件使用 各向异性导电粘合剂通过加热收缩和固化，以便电和机械地连接引线和电极。