发明授权
US06284982B1 Method and component for forming an embedded resistor in a multi-layer printed circuit
失效
在多层印刷电路中形成嵌入式电阻器的方法和组件
- 专利标题： Method and component for forming an embedded resistor in a multi-layer printed circuit
- 专利标题（中）： 在多层印刷电路中形成嵌入式电阻器的方法和组件
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申请号： US09641304申请日： 2000-08-18
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公开(公告)号： US06284982B1公开(公告)日： 2001-09-04
- 发明人: Mark Kusner , Michael A. Centanni
- 申请人： Mark Kusner , Michael A. Centanni
- 主分类号： H05K103
- IPC分类号： H05K103
摘要：
A component for use in forming a multi-layer printed circuit comprised of a film substrate formed of a first polymeric material. At least one layer of a flash metal is applied to a first side of the film substrate, and at least one layer of copper is applied on the layer of flash metal. A discrete area of a resistive material is disposed on a second side of the film substrate.
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