An insulated wire having excellent fabricability causing no cracking in the film even after severe winding or rolling fabrication and also having heat resistance comparable to that of polyamideimide is disclosed, in which a first insulation layer of a thermosetting resin composition having a Tg of 250° C. or higher is formed on a conductor, on which a second insulation layer formed of a mixture of a thermosetting resin composition having a Tg of 250° C. or higher and a thermoplastic resin composition having a Tg of 140° C. or higher is formed, and in which the adhesion of the insulation film to the conductor is 30 g/mm or more, and the elongation at break of the insulation film is 40% or more, with the mixing ratio of the thermoplastic resin in the second insulation layer being from 30 to 70% by weight and the ratio T1/T2 of the thickness T1 of the first insulation layer to the thickness T2 of the second insulation layer being within a range of 5/95 to 40/60, and a residual amount of the solvent in an insulation film is 0.05% by weight or less of the total amount of the insulation film in a preferred embodiment.