公开(公告)号：US06288342B1

公开(公告)日：2001-09-11

申请号：US09460647

申请日：1999-12-14

申请人： Isao Ueoka ,  Masaaki Yamauchi ,  Masaharu Kurata ,  Yoshihiro Nakazawa ,  Yuki Matsuura ,  Hideyuki Hashimoto ,  Hiromitu Asai ,  Shinichi Matsubara ,  Makoto Takahashi

发明人： Isao Ueoka ,  Masaaki Yamauchi ,  Masaharu Kurata ,  Yoshihiro Nakazawa ,  Yuki Matsuura ,  Hideyuki Hashimoto ,  Hiromitu Asai ,  Shinichi Matsubara ,  Makoto Takahashi

IPC分类号： H01B1760

CPC分类号： H01B7/292 ,  H01B3/306 ,  Y10T428/2947

摘要： An insulated wire having excellent fabricability causing no cracking in the film even after severe winding or rolling fabrication and also having heat resistance comparable to that of polyamideimide is disclosed, in which a first insulation layer of a thermosetting resin composition having a Tg of 250° C. or higher is formed on a conductor, on which a second insulation layer formed of a mixture of a thermosetting resin composition having a Tg of 250° C. or higher and a thermoplastic resin composition having a Tg of 140° C. or higher is formed, and in which the adhesion of the insulation film to the conductor is 30 g/mm or more, and the elongation at break of the insulation film is 40% or more, with the mixing ratio of the thermoplastic resin in the second insulation layer being from 30 to 70% by weight and the ratio T1/T2 of the thickness T1 of the first insulation layer to the thickness T2 of the second insulation layer being within a range of 5/95 to 40/60, and a residual amount of the solvent in an insulation film is 0.05% by weight or less of the total amount of the insulation film in a preferred embodiment.

摘要翻译： 公开了一种绝缘线，其具有优异的可制造性，即使在严格的卷绕或轧制制造之后也不会发生裂纹，并且还具有与聚酰胺酰亚胺相当的耐热性，其中Tg为250℃的热固性树脂组合物的第一绝缘层 以上，由Tg为250℃以上的热固性树脂组合物和Tg为140℃以上的热塑性树脂组合物的混合物形成的第二绝缘层形成在导体上， 并且其中绝缘膜与导体的粘合力为30g / mm以上，绝缘膜的断裂伸长率为40％以上，第二绝缘层的热塑性树脂的混合比 为30〜70重量％，第一绝缘层的厚度T1与第二绝缘层的厚度T2的比T1 / T2在5/95〜40/60的范围内，残留量o 绝缘膜中的溶剂在优选实施方案中为绝缘膜总量的0.05重量％以下。