An apparatus including a base substrate including a reference voltage plane. A plurality of spaced apart printed circuit substrates are attached to the base substrate. Each one of the printed circuit substrates includes a reference voltage plane attached to the reference voltage plane of the base substrate. A system component is removably attached to a first side of at least one of the printed circuit substrates. The system component is electrically connected to the reference voltage plane of the printed circuit substrate. A support member is attached to a second side of each printed circuit substrate. Each support member is electrically coupled to the reference voltage plane of the printed circuit substrate. The support members are electrically connected to a reference voltage plane of the printed circuit substrate to provide a low impedance return current path for the electrical portion of the electromagnetic emissions, thereby reducing the magnitude of electromagnetic emissions.