发明授权
- 专利标题: Pulsed etching manufacturing method and system
- 专利标题(中): 脉冲蚀刻制造方法和系统
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申请号: US09746689申请日: 2000-12-22
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公开(公告)号: US06307240B1公开(公告)日: 2001-10-23
- 发明人: Achyuta Achari , Lakhi N. Goenka
- 申请人: Achyuta Achari , Lakhi N. Goenka
- 主分类号: H01L2714
- IPC分类号: H01L2714
摘要:
A chemical etching manufacturing system is provided for removing material from a workpiece comprising a fluid control device, wherein the fluid control device controls at least one of fluid flow and fluid pressure, a fluid injection device, and a pulsed flow of chemical etchant adapted to pulsedly contact and remove material from a workpiece, wherein the pulse of the pulsed flow of chemical etchant is controlled by the fluid control device, and the pulsed flow of chemical etchant is emitted from the fluid injection device. A method of chemical etching in a manufacturing system is also provided comprising providing a workpiece, introducing the workpiece to a pulsed flow of chemical etchant, wherein the flow of chemical etchant pulsedly contacts and removes material from the workpiece, and removing the workpiece from the pulsed flow of chemical etchant.