摘要:
A flame sensor for combustion flame temperature determination comprises elongated extensions that are positioned with parallel interdigitated longitudinal axis with respect to one another. An optical spectrometer comprises the sensor and a system comprises the sensor. A method for combustion flame temperature determination comprises obtaining a first photodiode signal and a second photodiode signal by using photodiode devices comprising photodiodes with elongated extending interdigitated digits. A method of fabricating a flame sensor for combustion flame temperature determination, comprises forming first and second photodiodes with elongated extending interdigitated digits.
摘要:
A semiconductor element provided in a semiconductor device includes a built-in contact-type sensor having a sensor area formed on a circuit formation surface. Connection terminals are provided in an area other than the sensor area. A wiring board is connected to the connection terminals of the semiconductor element so that an end surface of the wiring board is positioned on the circuit formation surface. A protective resin part covers a part extending from the end surface of the wiring board to the circuit formation surface so as to protect a connection portion between the semiconductor element and the wiring board.
摘要:
A novel photodetector CMOS-compatible photodetector is disclosed in which photo-generation of carriers (electrons) is carried out in the metal of the electrodes, rather than as electron-hole pairs in the semiconductor on which the metal electrodes are deposited. The novel photo detector comprises a silicon or other semiconductor substrate material characterized by an electron energy bandgap, and a pair of metal electrodes disposed upon a surface of the silicon to define therebetween a border area of the surface. One of the two electrodes being exposed to the incident radiation and covering an area of said surface which is larger than the aforesaid border area, the aforesaid metal of the electrodes being characterized by a Fermi level which is within said electron energy bandgap.
摘要:
An improved vertical photo-detector cell is used in an imaging sensor. Sensor material associated with a given color in a vertical photo-detector cell is coupled to sensor material associated with the same color in an adjacent photo-detector cell such that photo-carriers from adjacent cells are combined. The coupled sensor materials result in an increased size sensor area for the given color. The increased sensor area associated with each pixel in the sensor results in increased sensitivity and improved fill factor for each color. In an imaging sensor array, the vertical photo-detector cells are arranged such that each color plane is arranged in a pattern. Each sensor in a pattern has a central portion and an extending portion. The central portion and the extending portion are each located about a geometrical center that is associated with a pixel in the array.
摘要:
An N-type impurity diffusion region is formed in an element forming region surrounded by a field insulating film. In a region between an end portion of the N-type impurity diffusion region and an end portion of the field oxide film, a P-type impurity diffusion region is formed so as to contain an interface level present portion under a bird's beak portion. Thus, a PN junction is formed in a position distant from the interface level present portion. Therefore, even if a voltage is applied to the PN junction, a depletion layer will not reach the interface level present portion. Consequently, a semiconductor device, which suppresses an occurrence of a leakage current along the lower surface of an element isolation insulating film caused by the interface level present portion undesirably included in the depletion layer, as well as a manufacturing method of the same can be obtained.
摘要:
A thermal imaging system comprising a camera (11), a control device (12) which is operable to control movement of the camera (11) and operation of the camera shutter and a computer (13) which includes thermal image processing software which allows manipulation or display of thermal images collected by the camera (11). The camera (11) is operated by use of the control device (12) to expose a thermal image over a selected time interval to correspondingly select a thermal image over a particular selected temperature range. The camera shutter is operated at a selected frequency, and exposure time of the image is varied to acquire thermal images over different selected temperature ranges. However, preferably every image is taken at the same time exposure, which allows display of a continuous real time display of thermal characteristics of the object over this selected temperature range. Thermal information over the other temperature range can also be displayed or used as desired.
摘要:
A method and apparatus for substantially canceling the effects of temperature on the electrical performance of Field Effect Transistor (FET) integrated circuits (IC's) by exploiting a subtle feature of an epitaxial resistor implemented in an FET process. Specifically, the invention takes advantage of two constituent epitaxial resistor components having resistances that vary monotonically in opposite directions as functions of temperature. The invention includes a method for selecting the geometry of such an epitaxial resistor to give it either temperature invariance or a specific, useful functional temperature dependence.
摘要:
An IC chip comprising, a nearby or remote source capable of particle emissions; circuitry formed in the IC chip that is adversely affected by impacts of particle emissions from said source; and a particle detector formed in the IC chip between the circuitry and source for detecting said particle emissions. In one embodiment of the present invention, the source comprises a solder ball that is formed on a surface of the IC chip, and the solder ball is capable of emitting alpha-particles. The particle emissions detector of the present invention is a reverse biased Schottky diode. The IC chip is formed by (a) providing an IC chip having at least one layer of particle sensitive circuitry formed therein; (b) forming another layer having at least one particle sensor region situated therein on a surface of said IC chip; and (c) optionally, forming at least one particle emission source over said another layer.
摘要:
A process for reworking a non-reflowed, defective microlens element shape, of an image sensor device, without damage to an underlying spacer layer, or to underlying color filter elements, has been developed. The non-reflowed, microlens element shape, if defective and needing rework, is first subjected to a high energy exposure, converting the non-reflowed, microlens element shape to a acid type, microlens shape, then removed using a base type developer solution. Prior to formation of a reworked microlens element shape a baking cycle is employed to freeze, or render inactive, any organic residue still remaining on the surface of the spacer layer, after the base type developer removal procedure. Formation of the reworked, microlens element shape, followed by an anneal cycle, results in the desired rounded, microlens element, on the underlying spacer layer.
摘要:
A method for fabricating a micromachined device with a fast release step is provided. A first undoped sacrificial layer is deposited on a structural layer. A doped sacrificial layer is deposited on the first undoped sacrificial layer. A second undoped sacrificial layer is deposited on the doped sacrificial layer to produce a layered structure. An etchant is then applied to the layered structure.