发明授权
- 专利标题: Thin resist with nitride hard mask for gate etch application
- 专利标题(中): 具有栅极蚀刻应用的氮化物硬掩模的薄抗蚀剂
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申请号: US09205211申请日: 1998-12-04
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公开(公告)号: US06309926B1公开(公告)日: 2001-10-30
- 发明人: Scott A. Bell , Christopher F. Lyons , Harry J. Levinson , Khanh B. Nguyen , Fei Wang , Chih Yuh Yang
- 申请人: Scott A. Bell , Christopher F. Lyons , Harry J. Levinson , Khanh B. Nguyen , Fei Wang , Chih Yuh Yang
- 主分类号: H01L218242
- IPC分类号: H01L218242
摘要:
A method of forming a gate structure is provided. In the method, a nitride layer is formed on a gate material layer. An ultra-thin photoresist layer is formed on the nitride layer. The ultra-thin photoresist layer is patterned with short wavelength radiation to define a pattern for the gate. The ultra-thin photoresist layer is used as a mask during a first etch step to transfer the gate pattern to the nitride layer. The first etch step includes an etch chemistry that is selective to the nitride layer over the ultra-thin photoresist layer. The nitride layer is used as a hard mask during a second etch step to form the gate by transferring the gate pattern to the gate material layer via the second etch step.
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