发明授权
- 专利标题： Bump bonding and sealing a semiconductor device with solder
- 专利标题（中）： 用焊料将半导体器件密封并密封
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申请号： US09131169申请日： 1998-08-07
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公开(公告)号： US06313529B1公开(公告)日： 2001-11-06
- 发明人: Shinji Yoshihara , Shigeyuki Akita
- 申请人： Shinji Yoshihara , Shigeyuki Akita
- 优先权： JP9-214574 19970808
- 主分类号： H01L2334
- IPC分类号： H01L2334
摘要：
On a circuit chip on which a processing circuit for sensor outputs is formed, bump electrodes and a sealing bump, which has a shape of rectangular frame and is arranged to surround the bump electrodes, are formed by Sn—Pb solder. On a sensor chip provided with a sensing portion, electrode pads to be bonded to the bump electrode and a joining pad to be bonded to the sealing bump are formed. When the sensor chip is connected onto the circuit chip, an air-tight space containing the sensing portion is formed by the sealing bump and the joining pad.