发明授权
- 专利标题： Photoresist removal using a polishing tool
- 专利标题（中）： 使用抛光工具去除光刻胶
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申请号： US09484601申请日： 2000-01-18
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公开(公告)号： US06315637B1公开(公告)日： 2001-11-13
- 发明人: Eric M. Apelgren , Jonathan B. Smith , Paul R. Besser
- 申请人： Eric M. Apelgren , Jonathan B. Smith , Paul R. Besser
- 主分类号： B24B100
- IPC分类号： B24B100
摘要：
The present invention is directed to semiconductor processing operations. In one illustrative embodiment, the invention comprises providing a wafer having a layer of photoresist formed thereabove, positioning the layer of photoresist in contact with a polishing pad or a polishing tool, and rotating at least one of the wafer and the polishing pad to remove substantially all of the layers of photoresist.
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