发明授权
US06319740B1 Multilayer protective coating for integrated circuits and multichip modules and method of applying same
失效
用于集成电路和多芯片模块的多层保护涂层及其应用方法
- 专利标题： Multilayer protective coating for integrated circuits and multichip modules and method of applying same
- 专利标题（中）： 用于集成电路和多芯片模块的多层保护涂层及其应用方法
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申请号： US08549349申请日： 1995-10-27
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公开(公告)号： US06319740B1公开(公告)日： 2001-11-20
- 发明人: Kenneth H. Heffner , Curtis W. Anderson
- 申请人： Kenneth H. Heffner , Curtis W. Anderson
- 主分类号： B05D136
- IPC分类号： B05D136
摘要：
Disclosed is a method of forming a multilayer opaque coating on an integrated circuit or multichip module. First, an opaque coating composition is heated to a molten state and the molten opaque coating composition is applied so as to form an opaque coating that overlies active circuitry on the surface of the integrated circuit or multichip module, to prevent optical and radiation based inspection and reverse engineering of the active circuitry. Further coatings are applied over the opaque coating to shield the active circuitry of the integrated circuit or multichip module from the adverse affects of electromagnetic interference and/or high energy radiation.
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