-
公开(公告)号：US06287985B1
公开(公告)日：2001-09-11
申请号：US08549350
申请日：1995-10-27
IPC分类号： H01L2131
CPC分类号： H01L23/573 , H01L21/56 , H01L23/295 , H01L2224/48091 , H01L2924/00014
摘要： Disclosed is a method of forming an opaque coating on an integrated circuit or multichip module. A coating composition is prepared and then heated to a temperature sufficient to transform the coating composition to a molten state. Next, the molten coating composition is applied to a surface of the integrated circuit device to form an opaque coating that overlies active circuitry on the surface, to prevent optical and radiation based inspection and reverse engineering of the active circuitry.
摘要翻译： 公开了在集成电路或多芯片模块上形成不透明涂层的方法。 制备涂料组合物，然后加热至足以将涂料组合物转化为熔融状态的温度。 接下来，将熔融涂料组合物施加到集成电路器件的表面，以形成覆盖表面上的有源电路的不透明涂层，以防止基于光和辐射的检测和有源电路的反向工程。
-
公开(公告)号：US5877093A
公开(公告)日：1999-03-02
申请号：US549351
申请日：1995-10-27
CPC分类号： H01L23/573 , H01L21/56 , H01L23/24 , H01L23/295 , H01L2224/48091 , H01L2224/8592 , H01L24/48 , H01L2924/00014 , H01L2924/14 , H01L2924/181
摘要： Disclosed is a method of forming a primer coating and an opaque coating on an integrated circuit or multichip module. First a primer coating composition is applied to a surface of the integrated circuit device or multichip module to form a primer coating that increases the resistance of the surface to thermal and mechanical damage that may occur as a result of the application of the opaque coating. An opaque coating composition is then heated to a molten state and the molten opaque coating composition is applied over the primer coating to form an opaque coating that overlies active circuitry on the surface, to prevent optical and radiation based inspection and reverse engineering of the active circuitry.
摘要翻译： 公开了一种在集成电路或多芯片模块上形成底漆涂层和不透明涂层的方法。 首先，将底漆涂料组合物施加到集成电路器件或多芯片模块的表面以形成底漆涂层，其增加由于施加不透明涂层而可能发生的表面对热和机械损伤的电阻。 然后将不透明的涂料组合物加热至熔融状态，并将熔融的不透明涂料组合物施加在底漆涂层上以形成覆盖表面上的有源电路的不透明涂层，以防止基于光学和辐射的检查和有源电路的逆向工程 。
-
公开(公告)号：US08210120B2
公开(公告)日：2012-07-03
申请号：US10941628
申请日：2004-09-14
CPC分类号： B05B13/0242 , B05B7/20 , H01L21/56 , H01L21/6715 , H01L23/585 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/00014
摘要： A system for building a TRC includes a spray mechanism for spraying a coating material, a target system including a rotatable spray-target that retains an object with a surface to be covered by the TRC, a temperature sensor, and a control system for controlling application of the coating material based on a temperature that is determined during the spraying. The temperature sensor may comprise a non-contact infrared sensor that may measure a temperature related to the object. The measured temperature may be controlled by varying the speed of the rotatable spray-target.
摘要翻译： 用于构建TRC的系统包括用于喷涂涂层材料的喷射机构，包括可旋转喷射目标的目标系统，所述目标系统保持物体具有被TRC覆盖的表面，温度传感器和用于控制应用的控制系统 基于在喷雾期间确定的温度。 温度传感器可以包括可以测量与物体相关的温度的非接触式红外传感器。 可以通过改变可旋转的喷射靶的速度来控制测量的温度。
-
4.发明申请公开(公告)号：US20090047797A1
公开(公告)日：2009-02-19
申请号：US11942572
申请日：2007-11-19
IPC分类号： H01L21/31
CPC分类号： H01L23/3135 , H01L23/3121 , H01L23/573 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49175 , H01L2224/8592 , H01L2924/01013 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A method of producing a microelectronic device resistant to tampering, inspection and damage from surrounding environment or operating conditions includes: (i) applying an adhesion layer on a circuit including a die fixed and electrically connected to a laminate substrate; (ii) spraying, through a flame spray process, a tamper resistant coating over the applied adhesion layer; (iii) applying a first encapsulant for filling spaces and air pockets; (iv) removing air and gases from the first encapsulant; and (v) applying a second encapsulant around the first encapsulant for providing a moisture barrier 42 and handling surfaces for the microelectronic device.
摘要翻译： 一种能够防止来自周围环境或操作条件的篡改，检查和损坏的微电子装置的制造方法包括：（i）在包括固定并电连接到层叠基板的模具的电路上施加粘附层; （ii）通过火焰喷涂工艺喷涂所施加的粘附层上的抗篡改涂层; （iii）施加第一密封剂以填充空间和气穴; （iv）从第一密封剂中除去空气和气体; 和（v）在第一密封剂周围施加第二密封剂以提供防潮层42和处理微电子器件的表面。
-
5.发明授权Multilayer protective coating for integrated circuits and multichip modules and method of applying same 失效用于集成电路和多芯片模块的多层保护涂层及其应用方法公开(公告)号：US06319740B1
公开(公告)日：2001-11-20
申请号：US08549349
申请日：1995-10-27
IPC分类号： B05D136
CPC分类号： H01L23/573 , H01L21/56 , H01L23/24 , H01L23/295 , H01L2224/48091 , H01L2224/8592 , H01L2924/00014 , H01L2924/16195 , H01L2924/3025 , H01L2924/00 , H01L2224/45099
摘要： Disclosed is a method of forming a multilayer opaque coating on an integrated circuit or multichip module. First, an opaque coating composition is heated to a molten state and the molten opaque coating composition is applied so as to form an opaque coating that overlies active circuitry on the surface of the integrated circuit or multichip module, to prevent optical and radiation based inspection and reverse engineering of the active circuitry. Further coatings are applied over the opaque coating to shield the active circuitry of the integrated circuit or multichip module from the adverse affects of electromagnetic interference and/or high energy radiation.
摘要翻译： 公开了一种在集成电路或多芯片模块上形成多层不透明涂层的方法。 首先，将不透明的涂料组合物加热至熔融状态，并施加熔融的不透明涂料组合物以形成覆盖在集成电路或多芯片模块的表面上的有源电路的不透明涂层，以防止基于光学和辐射的检查， 有源电路的逆向工程。 将其它涂层施加在不透明涂层上以屏蔽集成电路或多芯片模块的有源电路免受电磁干扰和/或高能量辐射的不利影响。
-
6.发明授权
公开(公告)号：US06072580A
公开(公告)日：2000-06-06
申请号：US235000
申请日：1999-01-21
CPC分类号： G01C19/661
摘要： A method for forming an electrode seal between an excitation electrode and a laser block in a ring laser gyro having increased bond durability, strength, and greater resistance to solvents and reactive compounds. A thin ring of sealing material is positioned between an excitation electrode and a laser block of the ring laser gyro, and the sealing material is compressed. Chemical and physical bonds are formed between the excitation electrode and the sealing material and between the sealing material and the laser block. A pre-determined electrical potential is applied across the excitation electrode, the sealing material, and the laser block for a pre-determined period of time and at a pre-determined temperature. The electrical potential increases the number of chemical and physical bonds that are formed at the seal, thus increasing the bond durability and strength.
摘要翻译： 一种在环形激光陀螺仪中在激发电极和激光块之间形成电极密封的方法，其具有增加的粘合耐久性，强度和对溶剂和反应性化合物的更大耐受性。 密封材料的薄环位于环形激光陀螺仪的激发电极和激光块之间，并且密封材料被压缩。 在激发电极和密封材料之间以及密封材料和激光块之间形成化学和物理键。 预激励电极，密封材料和激光块在预定时间段和预定温度下施加预定电位。 电位增加了在密封处形成的化学和物理键的数量，从而增加了粘结的耐久性和强度。
-
公开(公告)号：US5762711A
公开(公告)日：1998-06-09
申请号：US751146
申请日：1996-11-15
CPC分类号： H01L21/6715 , B05B12/124 , B05B13/0242 , H01L23/573 , B05B7/20 , H01L2224/48091 , H01L2224/8592 , H01L27/02 , H01L2924/00014 , H01L2924/09701 , H01L2924/16195
摘要： Protective and security coatings are applied to an integrated circuit by periodically passing the integrated circuit through a flame spray containing molten particles of the coating composition. The integrated circuit is attached to a fixture that is cooled with a coolant that is applied to the integrated circuit. The distance between the flame spray gun and the integrated circuit is controlled so that the particles are molten when they strike the circuit but the circuit heating is minimized. A flame resistant mask retains the integrated circuit on the fixture. The mask is constructed of a low thermally conductive material and the fixture is constructed of a high thermally conducive material.
摘要翻译： 通过周期性地使集成电路通过包含涂料组合物的熔融颗粒的火焰喷涂而将保护和安全涂层施加到集成电路。 集成电路连接到用施加到集成电路的冷却剂冷却的固定装置。 控制火焰喷枪和集成电路之间的距离，使得当它们撞击电路时，颗粒熔融，但电路加热最小化。 阻燃面罩将集成电路保持在灯具上。 掩模由低导热材料构成，夹具由高导热材料构成。
-
公开(公告)号：US07723162B2
公开(公告)日：2010-05-25
申请号：US11942572
申请日：2007-11-19
IPC分类号： H01L21/44
CPC分类号： H01L23/3135 , H01L23/3121 , H01L23/573 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49175 , H01L2224/8592 , H01L2924/01013 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A method of producing a microelectronic device resistant to tampering, inspection and damage from surrounding environment or operating conditions includes: (i) applying an adhesion layer on a circuit including a die fixed and electrically connected to a laminate substrate; (ii) spraying, through a flame spray process, a tamper resistant coating over the applied adhesion layer; (iii) applying a first encapsulant for filling spaces and air pockets; (iv) removing air and gases from the first encapsulant; and (v) applying a second encapsulant around the first encapsulant for providing a moisture barrier 42 and handling surfaces for the microelectronic device.
摘要翻译： 一种能够防止来自周围环境或操作条件的篡改，检查和损坏的微电子装置的制造方法包括：（i）在包括固定并电连接到层叠基板的模具的电路上施加粘附层; （ii）通过火焰喷涂工艺喷涂所施加的粘附层上的抗篡改涂层; （iii）施加第一密封剂以填充空间和气穴; （iv）从第一密封剂中除去空气和气体; 和（v）在第一密封剂周围施加第二密封剂以提供防潮层42和处理微电子器件的表面。
-
公开(公告)号：US6110537A
公开(公告)日：2000-08-29
申请号：US61847
申请日：1998-04-18
CPC分类号： H01L21/6715 , B05B12/124 , B05B13/0242 , H01L23/573 , B05B7/20 , H01L2224/48091 , H01L2224/8592 , H01L27/02 , H01L2924/00014 , H01L2924/09701 , H01L2924/16195
摘要： Protective and security coatings are applied to an integrated circuit by periodically passing the integrated circuit through a flame spray containing molten particles of the coating composition. The integrated circuit is attached to a fixture that is cooled with a coolant that is applied to the integrated circuit. The distance between the flame spray gun and the integrated circuit is controlled so that the particles are molten when they strike the circuit but the circuit heating is minimized. A flame resistant mask retains the integrated circuit on the fixture. The mask is constructed of a low thermally conductive material and the fixture is constructed of a high thermally conducive material.
摘要翻译： 通过周期性地使集成电路通过包含涂料组合物的熔融颗粒的火焰喷涂而将保护和安全涂层施加到集成电路。 集成电路连接到用施加到集成电路的冷却剂冷却的固定装置。 控制火焰喷枪和集成电路之间的距离，使得当它们撞击电路时，颗粒熔融，但电路加热最小化。 阻燃面罩将集成电路保持在灯具上。 掩模由低导热材料构成，夹具由高导热材料构成。
-
-
-
-
-
-
-
-
搜索结果
9 条记录 (耗时 0.013 秒)
