发明授权
US06319979B1 Package comprising low application temperature hot melt adhesive comprising ethylene &agr;-olefin
有权
包括包含乙烯α-烯烃的低应用温度热熔粘合剂的包装
- 专利标题: Package comprising low application temperature hot melt adhesive comprising ethylene &agr;-olefin
- 专利标题(中): 包括包含乙烯α-烯烃的低应用温度热熔粘合剂的包装
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申请号: US09496973申请日: 2000-02-02
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公开(公告)号: US06319979B1公开(公告)日: 2001-11-20
- 发明人: Robert A. Dubois , Cynthia L. Rickey , Steven W. Albrecht , Thomas F. Kauffman , Beth M. Eichler , Maynard Lawrence , Thomas H. Quinn
- 申请人: Robert A. Dubois , Cynthia L. Rickey , Steven W. Albrecht , Thomas F. Kauffman , Beth M. Eichler , Maynard Lawrence , Thomas H. Quinn
- 主分类号: C08J2700
- IPC分类号: C08J2700
摘要:
Disclosed are packages, cartons, cases, and trays comprising a hot melt adhesive, in turn comprising at least one first homogenous linear or substantially linear ethylene polymer having a particular density and melt viscosity at 350° F. (177° C.), up to 60 weight percent wax and up to 40 weight percent tackifier. In particular, disclosed are packages, cartons, cases, and trays comprising a hot melt adhesive characterized by: a) at least one homogeneous linear or substantially linear interpolymer of ethylene with at least one C3-C20 &agr;-olefin interpolymer having a density from 0.850 g/cm3 to 0.895 g/cm3; and b) up to 60 weight percent of at least one tackifying resin; and c) up to 40 weight percent of at least one wax, wherein the hot melt adhesive has a viscosity of less than about 5000 cPs (50 grams/(cm.second)) at 150° C.
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