Low application temperature hot melt adhesive comprising ethylene
.alpha.-olefin
    6.
    发明授权
    Low application temperature hot melt adhesive comprising ethylene .alpha.-olefin 失效
    低应用温度的包含乙烯α-烯烃的热熔粘合剂

    公开(公告)号:US6107430A

    公开(公告)日:2000-08-22

    申请号:US981990

    申请日:1998-01-08

    摘要: Disclosed are hot melt adhesives comprising at least one first homogeneous linear etylene polymer having a particular density and melt viscosity at 350.degree.F. (177.degree.C.), and an optional wax and tackifier. In particular, disclosed is a hot melt adhesive characterized by: a) at least one homogeneous linear or substantially linear interpolymer of ethylene with at least ibe C.sub.2 --C.sub.20 .alpha.-olefin interpolymer having a density from 0.850 g/cm.sup.3 to 0.895 g/cm.sup.3 ; and b) optionally at least one tackifying resin; and c) optionally at least one wax wherein the hot melt adhesive has a viscosity of less than about 5000 cPs (50 grams/cm.second) at 150.degree.C. Preferred hot melt adhesives for use in adhering cardboard or paperboard are disclosed, as well as the resultant adhered products. Also disclosed is a dual reactor process for the preparation of the inventive hot melt adhesives.

    摘要翻译: PCT No.PCT / US97 / 12366 Sec。 371日期1998年1月8日 102(e)1998年1月8日PCT PCT 1997年7月21日PCT公布。 公开号WO98 / 03603 日期1998年1月29日公开是包含至少一种在350°F(177℃)下具有特定密度和熔体粘度的第一均匀线型乙烯基聚合物和任选的蜡和增粘剂的热熔粘合剂。 特别地,公开了一种热熔粘合剂,其特征在于:a)至少一种乙烯与至少具有0.850g / cm 3至0.895g / cm 3密度的C 2 -C 20α-烯烃互聚物的均匀直链或基本线性互聚物; 和b)任选的至少一种增粘树脂; 和c)任选的至少一种蜡,其中热熔粘合剂在150℃下具有小于约5000cPs(50克/厘米2)的粘度。用于粘附纸板或纸板的优选热熔粘合剂作为 以及产生的附着产品。 还公开了用于制备本发明的热熔粘合剂的双反应器方法。