Invention Grant
- Patent Title: Cooling apparatus using boiling and condensing refrigerant
- Patent Title (中): 使用沸腾和冷凝制冷剂的冷却装置
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Application No.: US09456655Application Date: 1999-12-08
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Publication No.: US06321831B1Publication Date: 2001-11-27
- Inventor: Hiroshi Tanaka , Tadayoshi Terao , Kiyoshi Kawaguchi , Takahide Ohara , Akihiro Maeda , Eitaro Tanaka
- Applicant: Hiroshi Tanaka , Tadayoshi Terao , Kiyoshi Kawaguchi , Takahide Ohara , Akihiro Maeda , Eitaro Tanaka
- Priority: JP10-357381 19981216; JP10-357594 19981216; JP10-359958 19981218; JP11-268740 19990922
- Main IPC: F28D1500
- IPC: F28D1500

Abstract:
A cooling apparatus includes a refrigerant tank containing boiling and condensing refrigerant and a radiator for cooling the refrigerant. The radiator is connected to the refrigerant tank on a front surface thereof, and hot objects to be cooled are attached to a heat-receiving surface formed on a rear surface of the refrigerant tank. The refrigerant is circulated in the apparatus so that the refrigerant is vaporized in the refrigerant tank and condensed in the radiator. The radiator is connected to the refrigerant tank by inserting a pair of header tanks thereof into the refrigerant tank. The insertion length is controlled to obtain good heat conductivity between the radiator and the refrigerant tank and to avoid deformation of a radiator fin contacting the refrigerant tank. Holes for mounting a substrate carrying the hot objects may be made on enlarged portions of a cover plate closing the refrigerant tank. The heat-receiving surface may be elevated from the rear surface of the refrigerant tank to avoid interference between other components mounted on the substrate and the rear surface of the refrigerant tank.
Information query