发明授权
- 专利标题： Package for sealing an integrated circuit die
- 专利标题（中）： 用于密封集成电路管芯的封装
-
申请号： US08471748申请日： 1995-06-06
-
公开(公告)号： US06323550B1公开(公告)日： 2001-11-27
- 发明人: John R. Martin , Carl M. Roberts, Jr.
- 申请人： John R. Martin , Carl M. Roberts, Jr.
- 主分类号： H01L2312
- IPC分类号： H01L2312
摘要：
A die has a part that is sealed with a cap. The seal can be hermetic or non-hermetic. If hermetic, a layer of glass or metal is formed in the surface of the die, and the cap has a layer of glass or metal at a peripheral area so that, when heated, the layers form a hermetic seal. A non-hermetic seal can be formed by bonding a cap with a patterned adhesive. The cap, which can be silicon or can be a metal paddle, is electrically coupled to a fixed voltage to shield the part of the die.
信息查询
