发明授权
- 专利标题： Surface acoustic wave filter package
- 专利标题（中）： 表面声波滤波器封装
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申请号： US09357929申请日： 1999-07-21
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公开(公告)号： US06329887B1公开(公告)日： 2001-12-11
- 发明人: Kwang Hyun Baek
- 申请人： Kwang Hyun Baek
- 优先权： KR98-29937 19980724
- 主分类号： H03H910
- IPC分类号： H03H910
摘要：
SAW filter package which can reduce an electromagnetic feed-through for improving an SAW filter performance including a base having a frame around a periphery, a ground part formed of a metal plating on an inside surface of the base for attaching an acoustic surface wave filter thereto, cut-away portions formed by cutting the metal plating of the ground part in two steps, and a metal piece electrically separated from the metal plating by the cut-away portions.
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