公开(公告)号：US06534901B1

公开(公告)日：2003-03-18

申请号：US09890914

申请日：2001-11-21

申请人： Shigeru Tsuzuki ,  Kunihiro Fujii ,  Masahiro Takada ,  Satoshi Matsuo ,  Takafumi Koga ,  Kozo Murakami

发明人： Shigeru Tsuzuki ,  Kunihiro Fujii ,  Masahiro Takada ,  Satoshi Matsuo ,  Takafumi Koga ,  Kozo Murakami

IPC分类号： H03H910

CPC分类号： H03H9/1071 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/16195 ,  H03H3/08 ,  H03H9/0585 ,  H03H9/059 ,  Y10T29/42 ,  Y10T29/49117 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49789 ,  Y10T29/49798 ,  H01L2924/00014 ,  H01L2924/00

摘要： A SAW element (13) is formed of a piezoelectric substrate (14), on which are provided IDT electrodes (15), connection electrodes (16), underlying metal layers (17), and acoustic materials (18) placed on the underlying metal layers (17) and having surfaces parallel to the main surface of the piezoelectric substrate (14). The SAW element is mounted in a package (10), which is provided with external terminals (11) connected with the connection electrodes (16), and the package is hermetically sealed with a lid (20) to form a SAW device. When such a SAW element (13) is mounted faceup in a package (10) using a vacuum chuck (30), its piezoelectric substrate (14) can be protected against damage. When a SAW element (13) provided with bumps (23) on its connection electrodes (16) is mounted facedown in a package (10), the failure of electrical connections can be prevented.

摘要翻译： SAW元件（13）由压电基板（14）形成，其上设有IDT电极（15），连接电极（16），下面的金属层（17）和声学材料（18）放置在下面的金属 层（17）并且具有平行于压电基板（14）的主表面的表面。 SAW元件安装在具有与连接电极（16）连接的外部端子（11）的封装（10）中，并且封装件用盖（20）气密密封以形成SAW器件。 当使用真空卡盘（30）将这样的SAW元件（13）面对面地安装在封装（10）中时，可以保护其压电基板（14）免受损坏。 当在其连接电极（16）上设置有凸起（23）的SAW元件（13）面朝下安装在封装（10）中时，可以防止电连接的故障。

公开(公告)号：US06329887B1

公开(公告)日：2001-12-11

申请号：US09357929

申请日：1999-07-21

申请人： Kwang Hyun Baek

发明人： Kwang Hyun Baek

IPC分类号： H03H910

CPC分类号： H03H9/1071

摘要： SAW filter package which can reduce an electromagnetic feed-through for improving an SAW filter performance including a base having a frame around a periphery, a ground part formed of a metal plating on an inside surface of the base for attaching an acoustic surface wave filter thereto, cut-away portions formed by cutting the metal plating of the ground part in two steps, and a metal piece electrically separated from the metal plating by the cut-away portions.

摘要翻译： SAW滤波器封装，其可以减少用于改善SAW滤波器性能的电磁馈通，包括具有围绕周边的框架的基座，在基座的内表面上由金属电镀形成的接地部分，用于将声表面波滤波器附接到其上 通过两步切割接地部分的金属电镀形成的切割部分和通过切除部分与金属电镀电隔离的金属片。

公开(公告)号：US06781484B2

公开(公告)日：2004-08-24

申请号：US10338586

申请日：2003-01-08

申请人： Shigetoshi Matsuta

发明人： Shigetoshi Matsuta

IPC分类号： H03H910

CPC分类号： H03H9/02574 ,  H03H9/0542 ,  H03H9/0552

摘要： In a SAW filter module in which a SAW chip is mounted in a recess of a substrate, the recess is closed off by a sealing plate, and end-face electrodes are provided on external surfaces including the side surfaces of the substrate. An insulation layer having a smooth surface is provided on the side opposite to the sealing plate side of the substrate, and a thin film circuit, such as circuit elements, is formed on the insulation layer. A thin film circuit of high accuracy can be formed on the insulation layer, the number of chip components whose pitch between components is severely limited, and miniaturization of the entire module can be achieved.

摘要翻译： 在其中SAW芯片安装在基板的凹部中的SAW滤波器模块中，通过密封板封闭凹部，并且在包括基板的侧表面的外表面上设置端面电极。 具有光滑表面的绝缘层设置在与衬底的密封板侧相对的一侧上，并且在绝缘层上形成诸如电路元件的薄膜电路。 可以在绝缘层上形成高精度的薄膜电路，可以实现组件之间的间距严格限制的芯片部件的数量以及整个模块的小型化。

公开(公告)号：US06628178B2

公开(公告)日：2003-09-30

申请号：US09940440

申请日：2001-08-29

申请人： Fumio Uchikoba

发明人： Fumio Uchikoba

IPC分类号： H03H910

CPC分类号： H03H7/465 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H03H9/0542 ,  H05K1/0306 ,  H05K3/244 ,  H05K3/328 ,  H05K3/341 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401

摘要： The surface acoustic wave elements and the other surface mounting elements are mounted on a ceramic multi-layer substrate. The surface acoustic wave elements may be flip chips face-down-bonded to the gold coated mounting electrodes of the multi-layer ceramic substrate by gold-to-gold bonding. At least the surface acoustic wave elements are covered as sealed airtight with the side walls fixed to the multi-layer ceramic substrate and a cover closing the opening of the side walls.

摘要翻译： 表面声波元件和其它表面安装元件安装在陶瓷多层基板上。 表面声波元件可以是通过金 - 金键合将倒装芯片面向下键合到多层陶瓷衬底的镀金安装电极。 至少表面声波元件被密封地密封，侧壁固定到多层陶瓷基底和盖子封闭侧壁的开口。

公开(公告)号：US06541897B2

公开(公告)日：2003-04-01

申请号：US10052727

申请日：2002-01-23

申请人： Hideo Endoh

发明人： Hideo Endoh

IPC分类号： H03H910

CPC分类号： H03H9/1021

摘要： A package for a piezoelectric resonator, includes an insulating base that has a rectangular box shape and made of laminated thin ceramics sheets, and a lid that is made of a thin rectangular sheet of transparent glass material and bonded on the top surface of the base. A tuning fork type quartz crystal resonator element is hermetically sealed in the package. The corners of the lid are cut off diagonally at an angle of approximately 45 degrees or rounded so as to correspond to the cutouts of quarter circles at the corners of the base that result from via holes for wiring inside the base. A predetermined sealing width on the top surface of the base between the lid and the inner periphery of the base and a sufficient margin width between the periphery of the lid and the outer periphery of the base are ensured at the corners. The base has a through hole which enables the inside of the package to communicate with the outside and is hermetically sealed in a vacuum atmosphere with sealing medium after the lid is bonded. Sufficient bonding and sealing strength between the base and lid is ensured while miniaturization and flattening of a piezoelectric resonator are implemented. Gas within the package is minimized and the package can be sealed with the inside being subject to a high vacuum.