发明授权
- 专利标题: Polishing method and polishing device
- 专利标题(中): 抛光方法和抛光装置
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申请号: US09509208申请日: 2000-03-24
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公开(公告)号: US06332830B1公开(公告)日: 2001-12-25
- 发明人: Kouichi Okamura , Fumio Suzuki , Hisashi Masumura
- 申请人: Kouichi Okamura , Fumio Suzuki , Hisashi Masumura
- 优先权: JP10-220573 19980804
- 主分类号: B24B100
- IPC分类号: B24B100
摘要:
A polishing method and a polishing apparatus that are for making contact pressure between a work and a polishing pad substantially uniform within surfaces to obtain a work having good quality. A turn table (2) is supported by a grooved surface of a turn table receiving member (3b), the grooved surface being provided with grooves (9b) in a straight direction, a work (W) is pressed against a polishing pad (8) adhered to the turn table (2) while flowing polishing slurry, and a polishing is carried out by rotating the work (W) and the turn table (2).