公开(公告)号：US06332830B1

公开(公告)日：2001-12-25

申请号：US09509208

申请日：2000-03-24

申请人： Kouichi Okamura ,  Fumio Suzuki ,  Hisashi Masumura

发明人： Kouichi Okamura ,  Fumio Suzuki ,  Hisashi Masumura

IPC分类号： B24B100

CPC分类号： B24B37/11 ,  B24B41/047 ,  B24D9/08

摘要： A polishing method and a polishing apparatus that are for making contact pressure between a work and a polishing pad substantially uniform within surfaces to obtain a work having good quality. A turn table (2) is supported by a grooved surface of a turn table receiving member (3b), the grooved surface being provided with grooves (9b) in a straight direction, a work (W) is pressed against a polishing pad (8) adhered to the turn table (2) while flowing polishing slurry, and a polishing is carried out by rotating the work (W) and the turn table (2).

摘要翻译： 一种用于使工件与抛光垫之间的接触压力在表面内基本均匀的抛光方法和抛光装置，以获得具有良好质量的工件。 转台（2）由转台接收构件（3b）的带槽表面支撑，开槽面在直线方向上设有槽（9b），工件（W）被压靠在抛光垫（8）上 ）在流动抛光浆料的同时粘附到转台（2），并且通过旋转工件（W）和转台（2）来进行抛光。

公开(公告)号：US06386957B1

公开(公告)日：2002-05-14

申请号：US09581707

申请日：2000-06-16

申请人： Hisashi Masumura ,  Kouichi Tanaka ,  Fumio Suzuki ,  Kouzi Morita ,  Kouichi Okamura ,  Naotaka Toyama

发明人： Hisashi Masumura ,  Kouichi Tanaka ,  Fumio Suzuki ,  Kouzi Morita ,  Kouichi Okamura ,  Naotaka Toyama

IPC分类号： B24B100

CPC分类号： B24B37/30 ,  B05D1/32 ,  B05D3/042 ,  B24B7/00 ,  B25B11/005 ,  H01L21/6838

摘要： By improving the material of workpiece holder body of a workpiece holder for polishing that holds a workpiece by vacuum adsorption, and the material of resin film for coating a workpiece holding surface of the holder, and developing a method for coating the surface with a resin, which does not cause blocking of perforated holes of the holder body with the resin during the resin coating process, there are provided a workpiece holder for polishing having a workpiece holding surface of high precision, and a method for producing it. According to the present invention, there are provided a workpiece holder for polishing having a workpiece holder body provided with multiple perforated holes for holding a workpiece by vacuum adsorption, wherein a holding surface of the holder body is coated with a coating film formed by applying a thermosetting resin on the holding surface and curing it with heating, and a surface of the coating film is polished, and a method for producing it.

摘要翻译： 通过改善通过真空吸附保持工件的用于抛光的工件保持器的工件保持体的材料和用于涂覆保持件的工件保持表面的树脂膜的材料，并且开发用树脂涂覆表面的方法， 在树脂涂布过程中不会使树脂堵塞保持体的穿孔，提供了具有高精度的工件保持面的研磨用工件保持架及其制造方法。 根据本发明，提供了一种用于抛光的工件保持器，其具有设置有多个用于通过真空吸附保持工件的多孔的工件保持器本体，其中，保持器主体的保持表面涂覆有涂覆膜， 将热固性树脂固化在保持表面上并加热固化，并且对该涂膜的表面进行抛光及其制造方法。

公开(公告)号：US06422922B1

公开(公告)日：2002-07-23

申请号：US09647505

申请日：2000-09-29

申请人： Kouichi Okamura ,  Fumio Suzuki ,  Hisashi Masumura ,  Kouzi Morita ,  Naotaka Toyama

发明人： Kouichi Okamura ,  Fumio Suzuki ,  Hisashi Masumura ,  Kouzi Morita ,  Naotaka Toyama

IPC分类号： B24B100

CPC分类号： B24B37/30

摘要： A workpiece holder for polishing comprising a workpiece holder body which is provided with multiple perforated holes for holding a workpiece by vacuum suction and a holder back plate which is closely contacted with a back face of the holder body and has grooves for vacuum, wherein the holder back plate is composed of a synthetic resin and has an Asker C hardness of 70 or higher but lower than 98, and an apparatus for polishing a workpiece and a method for polishing a workpiece utilizing it. By improving the material of holder back plate of a workpiece holder for polishing that holds a workpiece by vacuum suction to enhance sealing with the holder body, thereby developing such a holder back plate that should not transfer deformation of the holder body to the workpiece surface, even if polishing agent slurry is introduced and solidified, to provide a workpiece holder for polishing having a workpiece holding surface of high precision, an apparatus for polishing a workpiece and a method for polishing a workpiece.

摘要翻译： 一种用于抛光的工件保持器，包括：工件保持器主体，其具有用于通过真空吸附保持工件的多个穿孔;以及保持器背板，其与保持器主体的背面紧密接触并具有用于真空的凹槽，其中， 背板由合成树脂构成，具有70以上且低于98的Asker C硬度，以及用于研磨工件的装置以及利用该工件抛光工件的方法。 通过改善用于通过真空抽吸保持工件的用于抛光的工件保持器的保持器背板的材料，以增强与保持体的密封性，从而显影不应该将保持器主体的变形转移到工件表面的保持器背板， 即使抛光剂浆料被引入和固化，也可提供具有高精度的工件保持表面的抛光用工件保持器，用于研磨工件的设备和抛光工件的方法。

公开(公告)号：US06399498B1

公开(公告)日：2002-06-04

申请号：US09244697

申请日：1999-02-04

申请人： Hisashi Masumura ,  Fumio Suzuki ,  Kouichi Okamura

发明人： Hisashi Masumura ,  Fumio Suzuki ,  Kouichi Okamura

IPC分类号： H01L21302

CPC分类号： B24B37/015

摘要： There is disclosed a method of processing a work comprising polishing a work holding surface 4a of a work holding plate 4 by contacting and rubbing a work holding surface 4a of a work holding plate 4 with a polishing pad 2 attached on a polishing turn table 1 with providing polishing agent 5 thereto, holding a wafer W on said work holding surface 4a by vacuum-holding, and contacting and rubbing the wafer W with said polishing pad 2 to polish the work with providing polishing agent 5 wherein temperature of the polishing agent 5 or the polishing turn table 1 is controlled by temperature controller 7,9 so that a temperature of said work holding surface 4a when polishing said work holding plate 4 and a temperature of said work holding surface 4a when polishing the wafer w are controlled to be the same. Degradation of flatness due to thermal influence when polishing the holding plate and polishing the wafer can be prevented in a method of processing comprising polishing the work holding surface of the work holding plate to conform with the deformed shape of the polishing pad, holding a work with the work holding surface, and polishing the work.

摘要翻译： 公开了一种处理工件的方法，其包括通过使工件保持板4的工件保持表面4a与安装在抛光台1上的抛光垫2接触和摩擦来抛光工件保持板4的工件保持表面4a， 向其提供抛光剂5，通过真空保持将晶片W保持在所述工件保持表面4a上，并且与抛光垫2接触并摩擦晶片W以抛光工件以提供抛光剂5，其中抛光剂5的温度或 抛光转台1由温度控制器7,9控制，使得当抛光所述工件保持板4时所述工件保持表面4a的温度和当研磨晶片w时所述工件保持表面4a的温度被控制为相同 。 可以防止在研磨保持板并抛光晶片时由于热影响而导致的平坦度的降低，包括：研磨工件保持板的工件保持表面以符合抛光垫的变形形状，保持工件 工作保持面，并抛光工作。

公开(公告)号：US06769966B2

公开(公告)日：2004-08-03

申请号：US09979641

申请日：2001-11-26

申请人： Kouichi Okamura ,  Noboru Tamai ,  Kouzi Morita ,  Hisashi Masumura

发明人： Kouichi Okamura ,  Noboru Tamai ,  Kouzi Morita ,  Hisashi Masumura

IPC分类号： B24B722

CPC分类号： B24B37/30 ,  B24B49/14 ,  H01L21/6838

摘要： The present invention is a workpiece holder for polishing comprising at least a workpiece holder body having multiple perforated holes for holding a workpiece by vacuum adsorption and a back plate disposed on the back side of the body, which is provided with temperature controlling means or cooling means for the holder body. Thus, there is provided a workpiece holder for polishing, a polishing apparatus and a polishing method, which can provide a workpiece having good flatness by suppressing thermal deformation of the workpiece holder body and deformation of a resin film coated on the workpiece holding surface without degrading flatness of a workpiece held on the workpiece holder in the polishing of the workpiece, even when the number of polishing operation increases.

摘要翻译： 本发明是一种用于抛光的工件保持器，其至少包括具有多个用于通过真空吸附保持工件的多孔的工件保持器主体和设置在主体的背面上的背板，该背板设置有温度控制装置或冷却装置 为持有人身体。 因此，提供了用于抛光的工件保持器，抛光装置和抛光方法，其可以通过抑制工件保持体的热变形和涂覆在工件保持表面上的树脂膜的变形而提供具有良好平坦度的工件，而不会降低 即使当研磨次数增加时，工件保持在工件的抛光中的工件的平坦度。

公开(公告)号：US08268114B2

公开(公告)日：2012-09-18

申请号：US10490480

申请日：2002-09-27

申请人： Hisashi Masumura ,  Fumio Suzuki ,  Kouji Kitagawa

发明人： Hisashi Masumura ,  Fumio Suzuki ,  Kouji Kitagawa

IPC分类号： H01L21/68 ,  H01L21/304 ,  B24B37/04

CPC分类号： B24B37/30

摘要： A workpiece holder for polishing includes a workpiece holder body having multiple perforated holes to hold a workpiece by vacuum suction. A holding surface of the workpiece holder body may be coated with resin. A coefficient of thermal expansion of the resin coating on the holding surface may be 1×10−5/K or less. The resin coating on the holding surface may be epoxy resin filled with silica particles.

摘要翻译： 用于抛光的工件保持器包括具有多个穿孔的工件保持器主体，以通过真空抽吸来保持工件。 工件保持体的保持面可以涂布树脂。 保持表面上的树脂涂层的热膨胀系数可以为1×10-5 / K以下。 保持表面上的树脂涂层可以是填充有二氧化硅颗粒的环氧树脂。

公开(公告)号：US08021210B2

公开(公告)日：2011-09-20

申请号：US12733535

申请日：2008-10-20

申请人： Hisashi Masumura ,  Kouji Morita ,  Hiromasa Hashimoto ,  Satoru Arakawa ,  Hiromi Kishida

发明人： Hisashi Masumura ,  Kouji Morita ,  Hiromasa Hashimoto ,  Satoru Arakawa ,  Hiromi Kishida

IPC分类号： B24B49/00

CPC分类号： B24B37/30 ,  B24B41/06

摘要： The present invention is a polishing head in which a rubber film is formed in a boot shape in such a manner that a position where the rubber film is held by a mid plate is distantly positioned from a work holding portion; an end portion of the boot shaped rubber film is formed in O-ring shape so that the rubber film is held by the mid plate with decreasing an area of contact between the mid plate and the rubber film as much as possible. As a result, there is provided a polishing head with rubber chuck method in which an occurrence of a surface defect, such as a scratch, on a surface of the work is suppressed as much as possible and the work can be uniformly and stably polished to the outer periphery.

摘要翻译： 本发明是一种研磨头，其中橡胶膜形成为靴形，其中橡胶膜由中间板保持的位置远离工件保持部分; 靴形橡胶膜的端部形成为O形环，使得橡胶膜由中间板保持，尽可能地减小中间板和橡胶膜之间的接触面积。 结果，提供了一种具有橡胶卡盘方法的抛光头，其中尽可能地抑制了在工件的表面上发生诸如划痕的表面缺陷，并且可以将工件均匀且稳定地抛光到 外围。

公开(公告)号：US07582221B2

公开(公告)日：2009-09-01

申请号：US10181829

申请日：2001-10-22

申请人： Shigeyoshi Netsu ,  Hisashi Masumura

发明人： Shigeyoshi Netsu ,  Hisashi Masumura

IPC分类号： C03C15/00 ,  H01L21/302

CPC分类号： H01L21/02024 ,  B24B37/345

摘要： The present invention provides a wafer manufacturing method and a wafer polishing apparatus which enable control of sags in a periphery of a wafer and improvement of nanotopology values thereof that is strongly required recently, and a wafer. In a polishing process for making a mirror surface of the wafer, a back surface of the wafer is polished to produce a reference plane thereof.

摘要翻译： 本发明提供一种晶片制造方法和晶片抛光装置，其能够控制晶片周边的下垂和最近需要强烈要求的纳米拓扑学值的改善以及晶片。 在用于制造晶片的镜面的抛光工艺中，抛光晶片的后表面以产生其参考平面。

公开(公告)号：US06558233B1

公开(公告)日：2003-05-06

申请号：US09719564

申请日：2000-12-28

申请人： Takashi Matsuoka ,  Naotaka Toyama ,  Hideki Munakata ,  Hisashi Masumura

发明人： Takashi Matsuoka ,  Naotaka Toyama ,  Hideki Munakata ,  Hisashi Masumura

IPC分类号： B24B100

CPC分类号： H01L21/02052 ,  H01L21/02024

摘要： Provided are a wafer polishing method in which, in single side polishing, covering a wafer holding surface (one side surface) with a protective film, a wafer polishing surface (the other side surface) is polished, so that the wafer holding surface can be prevented from being etched and contaminated by a polishing agent; a wafer cleaning method in which the protective film that remains behind on the wafer holding surface after polishing can be efficiently removed, and a waste cleaning solution is easily treated; and a wafer protective film that sufficiently covers the wafer holding surface in polishing but is effectively removed in cleaning. In a wafer polishing method in which a wafer holding surface of one side surface of a wafer is held and a wafer polishing surface of the other side surface thereof is polished while dripping a polishing agent, the wafer polishing surface is polished while covering the wafer holding surface with a synthetic resin protective film of etching resistance against the polishing agent, good adhesiveness to the wafer and a property easy to peel off from the wafer after polishing.

摘要翻译： 提供一种晶片抛光方法，其中在单面抛光中，用保护膜覆盖晶片保持表面（一个侧表面），抛光晶片抛光表面（另一侧表面），使得晶片保持表面可以 防止被抛光剂蚀刻和污染; 可以有效地除去在抛光后保留在晶片保持面上的保护膜的晶片清洗方法，并且容易地处理废物清洁溶液; 以及晶片保护膜，其在抛光中充分地覆盖晶片保持表面，但在清洁中被有效地去除。 在晶片抛光方法中，晶片的一个侧表面的晶片保持表面和其另一侧表面的晶片抛光表面被抛光抛光剂，抛光晶片抛光表面，同时覆盖晶片保持 表面具有对抛光剂的耐蚀刻性的合成树脂保护膜，对晶片的良好粘合性和抛光后容易从晶片剥离的性质。

公开(公告)号：US5891353A

公开(公告)日：1999-04-06

申请号：US915579

申请日：1997-08-21

申请人： Hisashi Masumura ,  Kiyoshi Suzuki ,  Hideo Kudo ,  Teruaki Fukami

发明人： Hisashi Masumura ,  Kiyoshi Suzuki ,  Hideo Kudo ,  Teruaki Fukami

IPC分类号： B24B37/00 ,  C09K3/14 ,  H01L21/02 ,  H01L21/302 ,  H01L21/304 ,  H01L21/306 ,  B44C1/22

CPC分类号： H01L21/02024 ,  H01L21/30625 ,  Y10T428/21

摘要： A semiconductor wafer polishing agent contains mainly a silica containing polishing agent and is added with a polyolefin type fine particle material. The novel semiconductor wafer polishing agent is capable of low brightness polishing to the back face of the wafer, sensor detection of the front and back faces of the wafer, and suppression of dust to be generated by chipping of the back face of the wafer, thereby to increase the yield of semiconductor devices. A polishing method using the polishing agent and a novel semiconductor wafer having a back face with an unconventional surface shape are also disclosed.