发明授权
- 专利标题： Heat treating method and heat treating apparatus
- 专利标题（中）： 热处理方法和热处理装置
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申请号： US09666108申请日： 2000-09-20
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公开(公告)号： US06333493B1公开(公告)日： 2001-12-25
- 发明人: Hideaki Sakurai , Shinichi Ito , Iwao Higashikawa , Akitoshi Kumagae
- 申请人： Hideaki Sakurai , Shinichi Ito , Iwao Higashikawa , Akitoshi Kumagae
- 优先权： JP11-267654 19990921; JP11-273213 19990921
- 主分类号： H05B302
- IPC分类号： H05B302
摘要：
Disclosed is a heat treating method for heating a target substrate by means of light irradiation, in which a light irradiation treatment is applied to the target substrate a plurality of times such that adjacent light irradiated regions on the target substrate partially overlap with each other and that the adjacent light irradiated regions do not overlap with each other in the light irradiating periods.
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