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公开(公告)号：US06333493B1
公开(公告)日：2001-12-25
申请号：US09666108
申请日：2000-09-20
IPC分类号： H05B302
CPC分类号： H01L21/67115 , F26B3/28 , H05B3/0047
摘要： Disclosed is a heat treating method for heating a target substrate by means of light irradiation, in which a light irradiation treatment is applied to the target substrate a plurality of times such that adjacent light irradiated regions on the target substrate partially overlap with each other and that the adjacent light irradiated regions do not overlap with each other in the light irradiating periods.
摘要翻译： 公开了一种用于通过光照射加热目标基板的热处理方法，其中对目标基板进行多次光照射处理，使得目标基板上的相邻光照射区域彼此部分重叠，并且这些相互之间的相邻光照射区域彼此部分重叠， 相邻的光照射区域在光照射期间不重叠。
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公开(公告)号：US06680462B2
公开(公告)日：2004-01-20
申请号：US10282114
申请日：2002-10-29
IPC分类号： H05B368
CPC分类号： H01L21/67115 , F26B3/28 , H05B3/0047
摘要： Disclosed is an apparatus for heating a target substrate by means of light irradiation. The heating apparatus includes a substrate support section for supporting the target substrate, an irradiating light generating section for irradiating the light irradiating regions of the target substrate supported by the substrate support section, and a light irradiating region changing section for changing the light irradiating regions of the target substrate irradiated with the light generated from the irradiating light generation section.
摘要翻译： 公开了一种通过光照射加热目标基板的装置。 加热装置包括用于支撑目标基板的基板支撑部分，用于照射由基板支撑部分支撑的目标基板的光照射区域的照射光产生部分和用于改变基板支撑部分的光照射区域的光照射区域改变部分 所述目标基板用从所述照射光产生部产生的光照射。
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3.发明授权Heat treatment method and a heat treatment apparatus for controlling the temperature of a substrate surface 失效热处理方法和用于控制基板表面的温度的热处理装置公开(公告)号：US06483083B2
公开(公告)日：2002-11-19
申请号：US09877147
申请日：2001-06-11
申请人： Hideaki Sakurai , Akitoshi Kumagae , Iwao Higashikawa , Shinichi Ito , Tsunetoshi Arikado , Katsuya Okumura
发明人： Hideaki Sakurai , Akitoshi Kumagae , Iwao Higashikawa , Shinichi Ito , Tsunetoshi Arikado , Katsuya Okumura
IPC分类号： F27D1100
CPC分类号： G01J5/06 , G01J5/0003 , G05D23/27
摘要： A substrate to be processed on which a thin film is formed is supported by a support member. The substrate to be processed is heated by a heating section. The surface temperature is measured by a radiation thermometer, and the heating temperature of the heating section is controlled by a control section, in response to the temperature measured by the radiation thermometer. Further, a blackbody is provided at a position optically symmetrical to the radiation thermometer with respect to the surface of the thin film. The blackbody is set at a constant temperature. The blackbody cuts stray light (noise light) which enters into the radiation thermometer.
摘要翻译： 其上形成有薄膜的待处理基板由支撑部件支撑。 待加工的基板被加热部加热。 通过辐射温度计测量表面温度，并且响应于由辐射温度计测量的温度，加热部分的加热温度由控制部分控制。 此外，相对于薄膜的表面，在与辐射温度计光学对称的位置处设置黑体。 黑体被设定在恒温。 黑体切入进入辐射温度计的杂散光（噪声光）。
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4.发明授权Heat treatment method and a heat treatment apparatus for controlling the temperature of a substrate surface 失效热处理方法和用于控制基板表面的温度的热处理装置公开(公告)号：US06265696B1
公开(公告)日：2001-07-24
申请号：US09371845
申请日：1999-08-11
申请人： Hideaki Sakurai , Akitoshi Kumagae , Iwao Higashikawa , Shinichi Ito , Tsunetoshi Arikado , Katsuya Okumura
发明人： Hideaki Sakurai , Akitoshi Kumagae , Iwao Higashikawa , Shinichi Ito , Tsunetoshi Arikado , Katsuya Okumura
IPC分类号： F27B514
CPC分类号： G01J5/06 , G01J5/0003 , G05D23/27
摘要： A substrate to be processed on which a thin film is formed is supported by a support member. The substrate to be processed is heated by a heating section. The surface temperature is measured by a radiation thermometer, and the heating temperature of the heating section is controlled by a control section, in response to the temperature measured by the radiation thermometer. Further, a blackbody is provided at a position optically symmetrical to the radiation thermometer with respect to the surface of the thin film. The blackbody is set at a constant temperature. The blackbody cuts stray light (noise light) which enters into the radiation thermometer.
摘要翻译： 其上形成有薄膜的待处理基板由支撑部件支撑。 待加工的基板被加热部加热。 通过辐射温度计测量表面温度，并且响应于由辐射温度计测量的温度，加热部分的加热温度由控制部分控制。 此外，相对于薄膜的表面，在与辐射温度计光学对称的位置处设置黑体。 黑体被设定在恒温。 黑体切割进入辐射温度计的杂散光（噪声光）。
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公开(公告)号：US06495807B2
公开(公告)日：2002-12-17
申请号：US09983667
申请日：2001-10-25
IPC分类号： H05B302
CPC分类号： H01L21/67115 , F26B3/28 , H05B3/0047
摘要： Disclosed is a heat treating method for heating a target substrate by means of light irradiation, in which light irradiation treatment is applied to the target substrate such that the light irradiation regions of the target substrate do not overlap with each other, the light irradiation treatment being performed by using an irradiating light adjusted such that the distribution of the light intensity within the light irradiation region of the target substrate is rendered uniform.
摘要翻译： 公开了一种通过光照射对目标基板进行加热的热处理方法，其中对目标基板施加光照射处理，使得目标基板的光照射区域彼此不重叠，光照射处理为 通过使用被调整为使得目标基板的光照射区域内的光强度分布变得均匀的照射光进行。
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公开(公告)号：US5629115A
公开(公告)日：1997-05-13
申请号：US583857
申请日：1996-01-11
申请人： Kenji Kawano , Shinichi Ito , Iwao Higashikawa , Masamitsu Itoh , Takashi Kamo , Hiroaki Hazama , Takayuki Iwamatsu
发明人： Kenji Kawano , Shinichi Ito , Iwao Higashikawa , Masamitsu Itoh , Takashi Kamo , Hiroaki Hazama , Takayuki Iwamatsu
摘要： This invention provides an exposure mask including a translucent film formed on a light-transmitting substrate and having a mask pattern, and a stabilized region formed in the boundary between the light-transmitting substrate and the translucent film or on at least the surface of the translucent film to prevent variations in physical properties of the translucent film. In addition, this invention provides a method of manufacturing an exposure mask, including the steps of forming a translucent film on a light-transmitting substrate, forming a photosensitive resin film on the translucent film, forming a photosensitive resin pattern by exposing the photosensitive resin film to a radiation or a charged particle beam, removing an exposed portion of the translucent film by using the photosensitive resin pattern as a mask, removing the photosensitive resin pattern, and forming a stabilized region in the boundary between the light-transmitting substrate and the translucent film or on at least the surface of the translucent film before the step of forming the photosensitive resin film or after the step of forming the photosensitive resin pattern. Also, this invention provides an apparatus for manufacturing an exposure mask, including a light source for radiating light containing at least an exposure wavelength onto a translucent film formed on a light-transmitting substrate, a photodetecting unit for detecting light emitted from the light source and transmitted through or reflected by the translucent film, and a measuring unit for measuring the characteristic of the translucent film from the light detected by the photodetecting unit.
摘要翻译： 本发明提供一种曝光掩模，其包括形成在透光基板上并具有掩模图案的半透明膜，以及形成在透光基板和半透膜之间的边界中的至少半透明的表面的稳定区域 膜以防止半透明膜的物理性质的变化。 此外，本发明提供一种制造曝光掩模的方法，包括以下步骤：在透光性基板上形成半透膜，在半透膜上形成感光性树脂膜，通过使感光性树脂膜曝光，形成感光性树脂图案 通过使用感光性树脂图案作为掩模去除透光性膜的露出部分，除去感光性树脂图案，在透光性基板与透光性的界面之间形成稳定区域 或在形成感光性树脂膜的步骤之前或在形成感光性树脂图案的步骤之后，至少在半透明膜的表面上。 另外，本发明提供了一种用于制造曝光掩模的装置，包括用于将至少包含曝光波长的光发射到形成在透光基板上的半透明膜上的光源，用于检测从光源发射的光的光电检测单元和 通过透光膜透射或反射，以及测量单元，用于根据由光检测单元检测到的光来测量半透膜的特性。
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公开(公告)号：US5728494A
公开(公告)日：1998-03-17
申请号：US730017
申请日：1996-10-11
申请人： Kenji Kawano , Shinichi Ito , Iwao Higashikawa , Masamitsu Itoh , Takashi Kamo , Hiroaki Hazama , Takayuki Iwamatsu
发明人： Kenji Kawano , Shinichi Ito , Iwao Higashikawa , Masamitsu Itoh , Takashi Kamo , Hiroaki Hazama , Takayuki Iwamatsu
摘要： This invention provides an exposure mask including a translucent film formed on a light-transmitting substrate and having a mask pattern, and a stabilized region formed in the boundary between the light-transmitting substrate and the translucent film or on at least the surface of the translucent film to prevent variations in physical properties of the translucent film. In addition, this invention provides a method of manufacturing an exposure mask, including the steps of forming a translucent film on a light-transmitting substrate, forming a photosensitive resin film on the translucent film, forming a photosensitive resin pattern by exposing the photosensitive resin film to a radiation or a charged particle beam, removing an exposed portion of the translucent film by using the photosensitive resin pattern as a mask, removing the photosensitive resin pattern, and forming a stabilized region in the boundary between the light-transmitting substrate and the translucent film or on at least the surface of the translucent film before the step of forming the photo-sensitive resin film or after the step of forming the photosensitive resin pattern. Also, this invention provides an apparatus for manufacturing an exposure mask.
摘要翻译： 本发明提供一种曝光掩模，其包括形成在透光基板上并具有掩模图案的半透明膜，以及形成在透光基板和半透膜之间的边界中的至少半透明的表面的稳定区域 膜以防止半透明膜的物理性质的变化。 此外，本发明提供一种制造曝光掩模的方法，包括以下步骤：在透光性基板上形成半透膜，在半透膜上形成感光性树脂膜，通过使感光性树脂膜曝光，形成感光性树脂图案 通过使用感光性树脂图案作为掩模去除透光性膜的露出部分，除去感光性树脂图案，在透光性基板与透光性的界面之间形成稳定区域 或在形成感光树脂膜的步骤之前或在形成感光性树脂图案的步骤之后，至少在半透明膜的表面上。 此外，本发明提供了一种用于制造曝光掩模的装置。
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公开(公告)号：US5907393A
公开(公告)日：1999-05-25
申请号：US729592
申请日：1996-10-11
申请人： Kenji Kawano , Shinichi Ito , Iwao Higashikawa , Masamitsu Itoh , Takashi Kamo , Hiroaki Hazama , Takayuki Iwamatsu
发明人： Kenji Kawano , Shinichi Ito , Iwao Higashikawa , Masamitsu Itoh , Takashi Kamo , Hiroaki Hazama , Takayuki Iwamatsu
摘要： This invention provides an exposure mask including a translucent film formed on a light-transmitting substrate and having a mask pattern, and a stabilized region formed in the boundary between the light-transmitting substrate and the translucent film or on at least the surface of the translucent film to prevent variations in physical properties of the translucent film. In addition, this invention provides a method of manufacturing an exposure mask, including the steps of forming a translucent film on a light-transmitting substrate, forming a photosensitive resin film on the translucent film, forming a photosensitive resin pattern by exposing the photosensitive resin film to a radiation or a charged particle beam, removing an exposed portion of the translucent film by using the photosensitive resin pattern as a mask, removing the photosensitive resin pattern, and forming a stabilized region in the boundary between the light-transmitting substrate and the translucent film or on at least the surface of the translucent film before the step of forming the photosensitive resin film or after the step of forming the photosensitive resin pattern. Also, this invention provides an apparatus for manufacturing an exposure mask, including a light source for radiating light containing at least an exposure wavelength onto a translucent film formed on a light-transmitting substrate, a photodetecting unit for detecting light emitted from the light source and transmitted through or reflected by the translucent film, and a measuring unit for measuring the characteristic of the translucent film from the light detected by the photodetecting unit.
摘要翻译： 本发明提供一种曝光掩模，其包括形成在透光基板上并具有掩模图案的半透明膜，以及形成在透光基板和半透膜之间的边界中的至少半透明的表面的稳定区域 膜以防止半透明膜的物理性质的变化。 此外，本发明提供一种制造曝光掩模的方法，包括以下步骤：在透光性基板上形成半透膜，在半透膜上形成感光性树脂膜，通过使感光性树脂膜曝光，形成感光性树脂图案 通过使用感光性树脂图案作为掩模去除透光性膜的露出部分，除去感光性树脂图案，在透光性基板与透光性的界面之间形成稳定区域 或在形成感光性树脂膜的步骤之前或在形成感光性树脂图案的步骤之后，至少在半透明膜的表面上。 另外，本发明提供了一种用于制造曝光掩模的装置，包括用于将至少包含曝光波长的光发射到形成在透光基板上的半透明膜上的光源，用于检测从光源发射的光的光电检测单元和 通过透光膜透射或反射，以及测量单元，用于根据由光检测单元检测到的光来测量半透膜的特性。
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公开(公告)号：US06550990B2
公开(公告)日：2003-04-22
申请号：US10022637
申请日：2001-12-20
申请人： Hideaki Sakurai , Masamitsu Itoh , Shinichi Ito
发明人： Hideaki Sakurai , Masamitsu Itoh , Shinichi Ito
IPC分类号： G03D500
CPC分类号： G03D5/003
摘要： An apparatus for processing a substrate comprising a substrate holding mechanism for holding the substrate substantially horizontally, a chemical solution discharge/suction mechanism having a chemical solution discharge/suction portion which has a chemical solution outlet for discharging a chemical solution onto the substrate and chemical solution inlets for sucking up the chemical solution present on the substrate, and a chemical solution supply/suction system for supplying the chemical solution to the chemical solution discharge/suction mechanism simultaneously with sucking the chemical solution by the chemical solution supply/suction mechanism.
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公开(公告)号：US09644875B2
公开(公告)日：2017-05-09
申请号：US13882614
申请日：2010-12-22
申请人： Shinichi Ito , Masaki Toyoshima , Fumitake Unezaki
发明人： Shinichi Ito , Masaki Toyoshima , Fumitake Unezaki
CPC分类号： F25B49/02 , F24F3/1411 , F24F3/1429 , F24F11/0008 , F25B13/00 , F25B2313/006 , F25B2313/02741 , F25B2313/0314 , F25B2313/0315 , F25B2700/02 , F25B2700/1931 , F25B2700/1933
摘要： An air-conditioning system includes at least one outdoor unit including a compressor, a four-way valve, and an outdoor heat exchanger, at least one indoor unit including an indoor unit expansion valve and an indoor unit heat exchanger, and at least one humidity control device including a humidity control device expansion valve, a humidity control device heat exchanger, and first and second water adsorption/desorption devices. The compressor, the four-way valve, the outdoor heat exchanger, the indoor unit expansion valve, the indoor unit heat exchanger, the humidity control device expansion valve, and the humidity control device heat exchanger are connected to each other with pipes so as to constitute a refrigerant circuit.
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