发明授权
- 专利标题： Slurry dispenser and polishing apparatus
- 专利标题（中）： 浆料分配器和抛光装置
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申请号： US09173002申请日： 1998-10-15
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公开(公告)号： US06336850B1公开(公告)日： 2002-01-08
- 发明人: Yutaka Wada , Hirokuni Hiyama , Kazuto Hirokawa , Hisanori Matsuo
- 申请人： Yutaka Wada , Hirokuni Hiyama , Kazuto Hirokawa , Hisanori Matsuo
- 优先权： JP9-297891 19971015
- 主分类号： B24B722
- IPC分类号： B24B722
摘要：
A polisher includes a turntable with a polishing surface provided on the top surface of the turntable, an article carrier for holding an article to be polished in such a manner that the article is brought into contact with the polishing surface to polish the article, and a slurry dispenser for receiving and dispensing slurry to the polishing surface. The dispenser includes a slurry dispensing member for dispensing slurry to the polishing surface. The slurry dispensing member includes a contact surface facing and substantially contacting the polishing surface, and a slurry dispensing opening including at least one hole provided in the contact surface to dispense the slurry to the polishing surface therethrough. The opening is sized in such a manner that the opening covers substantially an area of the polishing surface which is to be brought into engagement with the article by relative movement between the article and the polishing surface.