公开(公告)号：US06520845B2

公开(公告)日：2003-02-18

申请号：US09813323

申请日：2001-03-21

申请人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo

发明人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo

IPC分类号： B24B2900

CPC分类号： B24B37/30 ,  B24B7/228 ,  B24B37/105 ,  B24B41/068 ,  B24B49/16

摘要： A polishing apparatus comprises a polishing member that has a wide stable polishing range to perform effective polishing, even if a rotation axis moves away from the edge of a workpiece. A polishing member holder holds the polishing member, and a workpiece holder holds the workpiece to be polished. A drive device produces a relative sliding motion between the polishing member and the workpiece. At least one holder of either the polishing member holder or the workpiece holder is rotatable about a rotation axis and is tiltable with respect to other holder. Such one holder is provided with a pressing mechanism to stabilize orientation or desired posture of the one holder by applying an adjusting pressure to the one holder at a location away from the rotation axis.

摘要翻译： 抛光装置包括抛光构件，其具有宽的稳定的抛光范围以进行有效的抛光，即使旋转轴线远离工件的边缘移动。 抛光构件保持器保持抛光构件，并且工件保持器保持待抛光的工件。 驱动装置在抛光构件和工件之间产生相对滑动运动。 抛光构件保持器或工件保持器中的至少一个保持器可围绕旋转轴线旋转并且可相对于其他保持器倾斜。 这种一个保持器设置有按压机构，以通过在远离旋转轴线的位置向一个保持器施加调节压力来稳定一个保持器的取向或期望姿势。

公开(公告)号：US06220945B1

公开(公告)日：2001-04-24

申请号：US09296567

申请日：1999-04-22

申请人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo

发明人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo

IPC分类号： B24B2900

CPC分类号： B24B37/30 ,  B24B7/228 ,  B24B37/105 ,  B24B41/068 ,  B24B49/16

摘要： A polishing apparatus comprises a polishing member that has a wide stable polishing range to perform effective polishing, even if a rotation axis moves away from the edge of a workpiece. A polishing member holder holds the polishing member, and a workpiece holder holds the workpiece to be polished. A drive device produces a relative sliding motion between the polishing member and the workpiece. At least one holder of either the polishing member holder or the workpiece holder is rotatable about a rotation axis and is tiltable with respect to other holder. Such one holder is provided with a pressing mechanism to stabilize orientation or desired posture of the one holder by applying an adjusting pressure to the one holder at a location away from the rotation axis.

公开(公告)号：US06402588B1

公开(公告)日：2002-06-11

申请号：US09300383

申请日：1999-04-27

申请人： Hisanori Matsuo ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa

发明人： Hisanori Matsuo ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa

IPC分类号： B24B4900

CPC分类号： B24B41/068 ,  B24B7/228 ,  B24B37/30 ,  B24B49/04 ,  B24B53/017

摘要： The object of the present invention is to provide a polishing apparatus having a grinding member in a compact design that can provide high efficiency for both polishing and dressing operations, and prevents tilting of the grinding member even if the rotation axis thereof is moved away from the outer periphery of the object. A polishing apparatus for an object, comprises: an object holder for holding an object to be polished, such that a surface of the object to be polished faces upward; a dresser disk holder for holding a dresser disk for dressing, such that a dressing surface thereof faces upward; and a grinding member for polishing the object, and for being dressed by the dresser disk, by pressing and sliding the grinding member relative to the object and the dresser disk. Thereby, the surface to be polished and the dressing surface are arranged so as to be coploanar, and the grinding member having an abrasive surface facing downward, is disposed so as to straddle the surface to be polished of the object and the dressing surface of the dresser disk to perform polishing of the surface to be polished and dressing of the abrasive surface of the grinding member.

摘要翻译： 本发明的目的是提供一种研磨装置，其具有紧凑设计的研磨构件，其可以为抛光和修整操作提供高效率，并且防止研磨构件的倾斜，即使其旋转轴线远离 物体的外围。 一种物体的抛光装置，包括：用于保持被抛光物体的物体保持器，使得待抛光物体的表面朝上; 修整器盘保持器，用于保持修整器盘用于修整，使得其修整面朝上; 以及研磨构件，用于抛光所述物体，并且由所述修整器盘修整，通过相对于所述物体和所述修整器盘压下并滑动所述研磨构件。 由此，被抛光面和修整面被配置成为共面的，并且具有面向下方的研磨面的研磨构件配置成跨越物体的被研磨面和修整面 修整器盘以执行抛光表面的抛光和研磨构件的研磨表面的修整。

公开(公告)号：US06672945B1

公开(公告)日：2004-01-06

申请号：US09641347

申请日：2000-08-18

申请人： Hisanori Matsuo ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa

发明人： Hisanori Matsuo ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa

IPC分类号： B24B100

CPC分类号： B24B53/017 ,  B24B49/14 ,  B24B53/001 ,  B24B53/12 ,  B24B55/02

摘要： A abstract polishing apparatus has a substrate carrier a substrate and an abrasive member having a polishing surface. The surface is slidingly engaged with the substrate in order to effect polishing. The dressing device includes a light source when generating light rays for irradiating the polishing surface of the abrasive member, whereby dressing the polishing surface. A temperature control system control the temperature of the polishing surface of the abrasive member by sensing the temperature of the polishing surface with the temperature sensor. Mechanical dressing of the polishing surface, in addition to dressing by radiation of the polishing surface, may also be employed in order to flatten the entire polishing surface. The abrasive member preferably includes an abrasive particles, a binder and a photophilic for promoting the dressing of the polishing surface by light rays.

摘要翻译： 抽象抛光装置具有基板载体，基底和具有抛光表面的磨料构件。 该表面与衬底滑动接合以便进行抛光。 修整装置在产生用于照射研磨部件的研磨面的光线时包括光源，由此修整研磨面。 温度控制系统通过用温度传感器感测研磨表面的温度来控制研磨部件的抛光表面的温度。 抛光表面的机械修整除了通过抛光表面的辐射进行修整之外，还可以采用平整整个抛光表面。 磨料构件优选地包括研磨颗粒，粘合剂和亲水性用于通过光线促进抛光表面的修整。

公开(公告)号：US06390901B1

公开(公告)日：2002-05-21

申请号：US09397916

申请日：1999-09-17

申请人： Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa ,  Hisanori Matsuo ,  Tetsuji Togawa ,  Satoshi Wakabayashi

发明人： Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa ,  Hisanori Matsuo ,  Tetsuji Togawa ,  Satoshi Wakabayashi

IPC分类号： B24B2900

CPC分类号： B24B37/11 ,  B24D9/085

摘要： An object of the present invention is to provide a polishing apparatus with a grinding plate that can easily and reliably be installed on and detached from a turntable. The polishing apparatus has a grinding plate tool, fixedly mounted on the turntable, which includes the grinding plate, and a top ring for holding a workpiece to be polished and pressing the workpiece against the grinding plate in sliding contact therewith for polishing a surface of the workpiece to a flat, mirror finish. A clamping mechanism is mounted in the turntable for fixing an outer circumferential flange of the grinding plate tool to the turntable.

摘要翻译： 本发明的目的是提供一种具有研磨板的抛光装置，其可以容易且可靠地安装在转台上和从转盘上拆下。 抛光装置具有固定安装在转盘上的研磨板工具，其包括研磨板，以及用于保持要抛光的工件的顶环，并将工件抵靠研磨板与其滑动接触，以抛光其中的表面 工件平整，镜面光洁。 夹持机构安装在转盘中，用于将研磨板工具的外周凸缘固定到转台上。

公开(公告)号：US06336850B1

公开(公告)日：2002-01-08

申请号：US09173002

申请日：1998-10-15

申请人： Yutaka Wada ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Hisanori Matsuo

发明人： Yutaka Wada ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Hisanori Matsuo

IPC分类号： B24B722

CPC分类号： B24B37/04 ,  B24B57/02

摘要： A polisher includes a turntable with a polishing surface provided on the top surface of the turntable, an article carrier for holding an article to be polished in such a manner that the article is brought into contact with the polishing surface to polish the article, and a slurry dispenser for receiving and dispensing slurry to the polishing surface. The dispenser includes a slurry dispensing member for dispensing slurry to the polishing surface. The slurry dispensing member includes a contact surface facing and substantially contacting the polishing surface, and a slurry dispensing opening including at least one hole provided in the contact surface to dispense the slurry to the polishing surface therethrough. The opening is sized in such a manner that the opening covers substantially an area of the polishing surface which is to be brought into engagement with the article by relative movement between the article and the polishing surface.

摘要翻译： 抛光机包括具有设置在转盘顶表面上的抛光表面的转台，用于保持待抛光物品的物品载体，使物品与抛光表面接触以对物品进行抛光，以及 用于将浆料接收和分配到抛光表面的浆料分配器。 分配器包括用于将浆料分配到抛光表面的浆料分配构件。 浆料分配构件包括面向并基本上接触抛光表面的接触表面，以及浆料分配开口，其包括设置在接触表面中的至少一个孔，以将浆料分配到通过其中的抛光表面。 开口的尺寸设计成使得开口基本上覆盖了通过制品和抛光表面之间的相对运动而与制品接合的抛光表面的一个区域。

公开(公告)号：US06190243B1

公开(公告)日：2001-02-20

申请号：US09306985

申请日：1999-05-07

申请人： Yutaka Wada ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Hisanori Matsuo

发明人： Yutaka Wada ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Hisanori Matsuo

IPC分类号： B24B2118

CPC分类号： B24B53/017

摘要： A polishing apparatus comprises a table having a smooth surface, a polishing pad provided on the smooth surface and a carrier for carrying an article to be polished The carrier brings the article into engagement with the pad under a pressure. The carrier and the table with the polishing pad are repeatedly moved relative to each other in a predetermined direction to thereby polish the article. A pressing device is positioned at a position spaced from the carrier is and adapted to be engaged with the polishing surface of the polishing pad. The pressing device includes a plurality of pressing elements which are arranged across an area of the polishing surface which area is to be brought into engagement with the article carried by the carrier and are adapted to individually press successive corresponding portions in the area to arrange the configuration of the surface of the area under corresponding various pressures.

摘要翻译： 抛光装置包括具有光滑表面的台面，设置在光滑表面上的抛光垫和用于承载待抛光物品的托架。承载件使得物品在压力下与垫接合。 载体和具有抛光垫的工作台在预定方向上相对于彼此重复地移动，从而抛光物品。 按压装置位于与载体间隔开的位置，并且适于与抛光垫的抛光表面接合。 按压装置包括多个按压元​​件，其横跨抛光表面的区域布置，该区域将与由承载件承载的物品接合，并且适于单独地按压该区域中的连续的对应部分以将构造 的面积在相应的各种压力下。

公开(公告)号：US06712678B1

公开(公告)日：2004-03-30

申请号：US09890880

申请日：2001-09-21

申请人： Yutaka Wada ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Hisanori Matsuo

发明人： Yutaka Wada ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Hisanori Matsuo

IPC分类号： B24B2900

CPC分类号： B24B53/017 ,  B24B57/02

摘要： It is an object of the present invention to provide a mechanism for effectively discharging debris produced when a substrate is polished by a bonded-abrasive element, and a polishing apparatus. According to the present invention, a polishing apparatus presses a surface of a substrate against a bonded-abrasive surface and moves the surface to be polished and the bonded-abrasive surface relative to each other to polish the surface. A mechanism is provided for discharging debris produced on the bonded-abrasive surface when the surface to be polished is polished.

摘要翻译： 本发明的目的是提供一种用于有效地排出当通过粘结研磨元件抛光基底时产生的碎屑的机构和抛光装置。 根据本发明，抛光装置将基板的表面压靠在粘合研磨表面上，并使被研磨表面和粘结研磨表面相对于彼此移动以抛光表面。 当抛光表面被抛光时，提供了用于排出在粘合研磨表面上产生的碎屑的机构。

公开(公告)号：US06579148B2

公开(公告)日：2003-06-17

申请号：US10166093

申请日：2002-06-11

申请人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo ,  Tetsuji Togawa

发明人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo ,  Tetsuji Togawa

IPC分类号： B24B4900

CPC分类号： B24B37/16 ,  B24B37/013 ,  B24B49/14 ,  B24B49/16 ,  B24B57/02

摘要： A polishing apparatus is used for polishing a surface of a workpiece such as a semiconductor wafer or a glass substrate. The polishing apparatus comprises a polishing table having a polishing surface thereon, a plurality of workpiece holders each for holding a workpiece and pressing the workpiece against the polishing surface, and a controller for controlling the workpiece holders individually so that polishing operations of the workpiece holders are controlled independently of each other.

公开(公告)号：US06458012B1

公开(公告)日：2002-10-01

申请号：US09612215

申请日：2000-07-07

申请人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo ,  Tetsuji Togawa

发明人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo ,  Tetsuji Togawa

IPC分类号： B24B4900

CPC分类号： B24B37/16 ,  B24B37/013 ,  B24B49/14 ,  B24B49/16 ,  B24B57/02

摘要： A polishing apparatus is used for polishing a surface of a workpiece such as a semiconductor wafer or a glass substrate. The polishing apparatus comprises a polishing table having a polishing surface thereon, a plurality of workpiece holders each for holding a workpiece and pressing the workpiece against the polishing surface, and a controller for controlling the workpiece holders individually so that polishing operations of the workpiece holders are controlled independently of each other.

摘要翻译： 抛光装置用于抛光诸如半导体晶片或玻璃基板的工件的表面。 抛光装置包括：抛光台，其上具有研磨面，多个工件保持件，每个工件保持件用于保持工件并将工件压靠在抛光表面上;以及控制器，其分别控制工件保持器，使得工件保持器的抛光操作 相互独立地控制。