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Invention Grant
US06338205B2 Footwear with molded web platform for attaching outsole 有权
用于连接外底的成型网平台的鞋类

  • Patent Title: Footwear with molded web platform for attaching outsole
  • Patent Title (中): 用于连接外底的成型网平台的鞋类
  • Application No.: US09474224
    Application Date: 1999-12-29
  • Publication No.: US06338205B2
    Publication Date: 2002-01-15
  • Inventor: David Mitchell
  • Applicant: David Mitchell
  • Main IPC: A43C1308
  • IPC: A43C1308
Footwear with molded web platform for attaching outsole
Abstract:
Footwear including a molded shell for enveloping the wearer's foot and wherein an integral web platform is molded with the shell. The bottom of the shell and the web platform is cemented to the outsole and then the web portion is stitched to the outsole.
Abstract(Chinese):

鞋类包括用于包围穿戴者的脚的模制外壳，并且其中整体的网状平台与外壳一起模制。 外壳底部和腹板平台胶合到外底，然后将腹板部分缝合到外底。

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