发明授权
- 专利标题： Buffer solutions for suspensions used in chemical-mechanical polishing
- 专利标题（中）： 用于化学机械抛光的悬浮液缓冲溶液
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申请号： US09403098申请日： 2000-04-03
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公开(公告)号： US06338743B1公开(公告)日： 2002-01-15
- 发明人: Claus Dusemund , Rudolf Rhein , Manuela Schweikert , Martin Hostalek
- 申请人： Claus Dusemund , Rudolf Rhein , Manuela Schweikert , Martin Hostalek
- 优先权： DE19715975 19970417
- 主分类号： C09G100
- IPC分类号： C09G100
摘要：
The present invention relates to buffer systems in the form of solutions or salts for preparing suspensions which can be used for chemomechanical polishing. In particular, these buffer systems can be used for preparing suspensions having a high pH of 9.5-13 which are used for the chemomechanical polishing of Si and metal surfaces of semiconductors, known as wafers.
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