摘要:
A composition for application to a surface and a method of making the same, said composition comprising at least one wax; at least one reaction product derived from a first surfactant and a second surfactant; and between 40% and 99.8% water by weight. The composition is made by: a) forming an emulsion by combining the water and the wax after heating both the water and the wax to a temperature greater than the melting point of the wax, where at least one of said water and said wax contains said first surfactant, said first surfactant being selected from the group consisting of a cationic surfactant and an anionic surfactant; and b) adding said second surfactant to the emulsion, said second surfactant having a charge which is opposite to that of said first surfactant.
摘要:
An article of footwear, such as an athletic shoe, having a wear resistant outsole is disclosed. The article of footwear includes an upper secured to a sole having a ground engaging portion with a wear resistant material composed of a thermoplastic polymer blended with from 0.1% to 2% of a fluorocarbon additive. In a preferred embodiment, the sole has ground engaging protrusions or cleats with at least the tip of one cleat composed of the wear resistant material. Preferably, the wear resistant material is a blend of thermoplastic polyurethane, such as Bayer Corporation's TEXIN 285™ or DESMONPAN 8785™, blended with 0.1% to 2% perfluoropolyether, such as DuPont KRYTOX™ general purpose oils and greases having GPL oil grades from 100 to 107, and more preferably having GPL oil grades from 101 to 105, inclusive.
摘要:
A slurry for chemical mechanical polishing (CMP) of a copper or silver containing film provides at least one reactant for reacting with the copper or silver film to form a soft layer on the surface of the copper or silver film. The soft layer has a hardness less than the copper or silver film. The slurry preferably includes either no particles or particles which are softer than the copper or silver layer. A method for chemical mechanical polishing (CMP) a copper or silver containing film includes the steps of providing a slurry for reacting with the copper or silver film to form a soft layer on the surface of the copper or silver film and uses either no particles or particles softer than the copper or silver film, applying the slurry to the copper or silver film to form the soft layer, and removing the soft layer using a polishing pad.
摘要:
The invention describes luminescent optically variable pigments (OVP), methods for obtaining such pigments, as well as the use of such pigments as security elements in inks, coatings and articles. The luminescence centers are preferably incorporated into the dielectric material of the OVP's optical Fabry-Perot resonance cavity, allowing for the machine-discrimination of luminescent OVP from simple mixtures of luminescents and non-luminescent OVP.
摘要:
The present invention relates to buffer systems in the form of solutions or salts for preparing suspensions which can be used for chemomechanical polishing. In particular, these buffer systems can be used for preparing suspensions having a high pH of 9.5-13 which are used for the chemomechanical polishing of Si and metal surfaces of semiconductors, known as wafers.
摘要:
CMP processes and products employ aluminas comprising alpha alumina particles having a particle width of less than 50 nanometers and a surface area of at least 50 m2/gm.