发明授权
US06338995B1 High-permittivity dielectric capacitor for a semiconductor device and method for fabricating the same 失效
一种用于半导体器件的高介电电容器及其制造方法

  • 专利标题: High-permittivity dielectric capacitor for a semiconductor device and method for fabricating the same
  • 专利标题(中): 一种用于半导体器件的高介电电容器及其制造方法
  • 申请号: US09368210
    申请日: 1999-08-04
  • 公开(公告)号: US06338995B1
    公开(公告)日: 2002-01-15
  • 发明人: Chul Ju HwangKi Bum Kim
  • 申请人: Chul Ju HwangKi Bum Kim
  • 优先权: KR98-31766 19980804
  • 主分类号: H01L218242
  • IPC分类号: H01L218242
High-permittivity dielectric capacitor for a semiconductor device and method for fabricating the same
摘要:
A high-permittivity dielectric capacitor and a fabrication method thereof are provided. The capacitor uses a tantalum oxynitride film as a high-permittivity dielectric film. The tantalum oxynitride film is deposited by chemical vapor deposition using tantalum ethoxide gas as a source of tantalum and oxygen and ammonia gas as a source of nitrogen. The tantalum oxynitride film has a high permittivity, a high thermal stability and a low interface heterogeneity between upper and lower electrodes. Thus, the current leakage due to oxygen vacancy in the film can be reduced.
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