发明授权
US06340608B1 Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads
失效
在端接铜焊盘上制造用于倒装芯片或芯片上IC封装的铜金属凸块的方法
- 专利标题： Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads
- 专利标题（中）： 在端接铜焊盘上制造用于倒装芯片或芯片上IC封装的铜金属凸块的方法
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申请号： US09612564申请日： 2000-07-07
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公开(公告)号： US06340608B1公开(公告)日： 2002-01-22
- 发明人: Simon Chooi , Yakub Aliyu , Mei Sheng Zhou , John Sudijono , Subhash Gupta , Sudipto Ranendra Roy , Paul Ho , Xu Yi
- 申请人： Simon Chooi , Yakub Aliyu , Mei Sheng Zhou , John Sudijono , Subhash Gupta , Sudipto Ranendra Roy , Paul Ho , Xu Yi
- 主分类号： H01L2150
- IPC分类号： H01L2150
摘要：
A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal track thereover are provided. A metal bump is formed over the exposed metal terminating pad. A photosensitive resin plug is formed over the metal bump. The metal bump of the semiconductor chip is aligned with the corresponding metal track on the separate substrate. The photosensitive resin plug over the metal bump is mated with the corresponding the metal track. The photosensitive resin plug is exposed to UV light to cure the photosensitive resin plug, permanently attaching the metal bump of the semiconductor chip to the corresponding metal track of the separate substrate.
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