发明授权
- 专利标题: Semiconductor device and manufacturing method thereof
- 专利标题(中): 半导体装置及其制造方法
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申请号: US09760733申请日: 2001-01-17
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公开(公告)号: US06342728B2公开(公告)日: 2002-01-29
- 发明人: Chuichi Miyazaki , Yukiharu Akiyama , Masanori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe
- 申请人: Chuichi Miyazaki , Yukiharu Akiyama , Masanori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe
- 优先权: JP8-66637 19960322
- 主分类号: H01L23495
- IPC分类号: H01L23495
摘要:
A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bonding pads of the semiconductor chip, a solder resist formed on the main surface of the flexible wiring substrate and solder bump electrodes connected to the other ends of the wirings. The elastomer is bonded to the flexible wiring substrate on the side of the tape, the solder resist is formed on the side of the wirings, and the solder bump electrodes are connected with the wirings by way of through holes formed in the solder resist.
公开/授权文献
- US20010002064A1 Semiconductor device and manufacturing method thereof 公开/授权日:2001-05-31