发明授权
- 专利标题： Semiconductor device with gold bumps, and method and apparatus of producing the same
- 专利标题（中）： 具有金凸块的半导体装置及其制造方法和装置
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申请号： US09691142申请日： 2000-10-19
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公开(公告)号： US06344690B1公开(公告)日： 2002-02-05
- 发明人: Masayuki Kitajima , Masakazu Takesue , Yoshitaka Muraoka
- 申请人： Masayuki Kitajima , Masakazu Takesue , Yoshitaka Muraoka
- 优先权： JP9-242459 19970908
- 主分类号： H01L2348
- IPC分类号： H01L2348
摘要：
A semiconductor device comprises a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.
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