公开(公告)号：US20060271217A1

公开(公告)日：2006-11-30

申请号：US11213947

申请日：2005-08-30

申请人： Kaname Suzuki ,  Kenji Hasegawa ,  Masahiko Yamada ,  Koji Yoshioka ,  Yoshitaka Muraoka

发明人： Kaname Suzuki ,  Kenji Hasegawa ,  Masahiko Yamada ,  Koji Yoshioka ,  Yoshitaka Muraoka

IPC分类号： G06F19/00

CPC分类号： G05B19/41805 ,  G05B2219/31034 ,  G05B2219/31056 ,  G05B2219/31061 ,  Y02P90/04 ,  Y02P90/10

摘要： A device to support studies of the positions in which parts necessary for assembly are placed and the positions in which assembly tasks are performed. A manufacturing study support device has a computation portion, a display portion which displays animations, and a storage portion which stores part animation data comprising three-dimensional shapes of parts, part storage positions which are three-dimensional coordinate data of positions at which the parts are stored, and assembly starting positions which are three-dimensional coordinate data of positions from which assembly tasks using the parts are started. The computation portion calculates part supply animation paths, taking the part storage positions as starting points and the assembly starting positions as ending points, and based on the part animation data and part supply animation paths, causes the display portion to display movement of the parts.

摘要翻译： 支持对组装所需部件的位置进行研究的装置以及执行组装任务的位置。 一种制造研究支持装置具有计算部分，显示动画的显示部分和存储部分动画数据的存储部分，该部分动画数据包括部分的三维形状，部分存储位置，其是部件的三维坐标数据 以及组装起始位置，这些起始位置是起始使用零件的组装任务的位置的三维坐标数据。 计算部分计算部分供应动画路径，将零件存储位置作为起点和装配开始位置作为终点，并且基于零件动画数据和零件供给动画路径，使显示部显示零件的移动。

公开(公告)号：US07101205B2

公开(公告)日：2006-09-05

申请号：US11033256

申请日：2005-01-12

申请人： Kiyoyuki Hatanaka ,  Satoshi Watanabe ,  Shigeo Iriguchi ,  Nobuo Taketomi ,  Yoshitaka Muraoka

发明人： Kiyoyuki Hatanaka ,  Satoshi Watanabe ,  Shigeo Iriguchi ,  Nobuo Taketomi ,  Yoshitaka Muraoka

IPC分类号： H01R3/00

CPC分类号： H05K1/028 ,  H01R12/59 ,  H01R35/02 ,  H04M1/0227

摘要： A flexible printed circuit board that electrically connects a main body and a rotary body to each other is twisted in advance through an angle that is a half of an angle of rotation through which the rotary body is rotated. One end of the flexible printed circuit board is fixed to the main body, and the other end thereof is fixed to the rotary body. The rotary body is rotated in a direction causing the twist of the flexible printed circuit board to diminish.

公开(公告)号：US06786385B1

公开(公告)日：2004-09-07

申请号：US09533365

申请日：2000-03-22

申请人： Masayuki Kitajima ,  Masakazu Takesue ,  Yoshitaka Muraoka

发明人： Masayuki Kitajima ,  Masakazu Takesue ,  Yoshitaka Muraoka

IPC分类号： B23K108

CPC分类号： H01L24/742 ,  B23K1/0016 ,  B23K35/26 ,  B23K35/262 ,  B23K35/3013 ,  B23K2101/36 ,  H01L21/6835 ,  H01L24/81 ,  H01L2224/03828 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/11822 ,  H01L2224/1184 ,  H01L2224/11901 ,  H01L2224/12 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/1358 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/53178 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device includes a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.

摘要翻译： 半导体器件包括具有电极的半导体元件和附接到电极的金属凸块。 金属凸块包括铜芯和覆盖芯的金表面层。 此外，金属凸块可以包括连接在一起的金突起元件和焊料凸块元件。

公开(公告)号：US06432806B1

公开(公告)日：2002-08-13

申请号：US09417770

申请日：1999-10-14

申请人： Masayuki Kitajima ,  Yutaka Noda ,  Yoshitaka Muraoka

发明人： Masayuki Kitajima ,  Yutaka Noda ,  Yoshitaka Muraoka

IPC分类号： H01L2144

CPC分类号： B23K26/10 ,  B23K26/382 ,  B23K26/40 ,  B23K2103/16 ,  B23K2103/30 ,  B23K2103/42 ,  B23K2103/50 ,  C03C15/00 ,  C03C23/0025 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15311 ,  H05K3/002 ,  H05K3/0029 ,  H05K3/0055 ,  H05K3/3478 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0525 ,  H05K2203/082 ,  H05K2203/107 ,  Y10S438/963 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2224/05599

摘要： A method of manufacturing a template having through-holes for attracting and supporting electrically conductive balls by vacuum suction is disclosed. The through-holes are formed by etching and the side walls of the through-holes are smoothed by irradiation, with laser beams, of the side walls of the through-holes. A template and metallic bumps can be formed using this method. Alternatively, the template can be formed in a two-layered structure.

摘要翻译： 公开了一种制造具有通过真空抽吸吸引和支撑导电球的通孔的模板的方法。 通过蚀刻形成通孔，并且通过激光束使通孔的侧壁平滑通孔的侧壁。 可以使用该方法形成模板和金属凸块。 或者，模板可以形成为两层结构。

公开(公告)号：US06344690B1

公开(公告)日：2002-02-05

申请号：US09691142

申请日：2000-10-19

申请人： Masayuki Kitajima ,  Masakazu Takesue ,  Yoshitaka Muraoka

发明人： Masayuki Kitajima ,  Masakazu Takesue ,  Yoshitaka Muraoka

IPC分类号： H01L2348

CPC分类号： H01L24/13 ,  B23K1/0016 ,  B23K35/26 ,  B23K35/262 ,  B23K35/3013 ,  B23K2101/36 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/0558 ,  H01L2224/056 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/11822 ,  H01L2224/1184 ,  H01L2224/11901 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1358 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13605 ,  H01L2224/13609 ,  H01L2224/13613 ,  H01L2224/13618 ,  H01L2224/13655 ,  H01L2224/13671 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/742 ,  H01L2224/75 ,  H01L2224/7501 ,  H01L2224/7515 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/81011 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3436 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099

摘要： A semiconductor device comprises a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.

摘要翻译： 半导体器件包括具有电极的半导体元件和附接到电极的金属凸块。 金属凸块包括铜芯和覆盖芯的金表面层。 此外，金属凸块可以包括连接在一起的金突起元件和焊料凸块元件。

公开(公告)号：US06320158B1

公开(公告)日：2001-11-20

申请号：US09231485

申请日：1999-01-14

申请人： Masayuki Kitajima ,  Yutaka Noda ,  Yoshitaka Muraoka ,  Fumihiko Tokura

发明人： Masayuki Kitajima ,  Yutaka Noda ,  Yoshitaka Muraoka ,  Fumihiko Tokura

IPC分类号： B23K2638

CPC分类号： B23K26/382 ,  B23K26/10 ,  B23K26/40 ,  B23K2103/16 ,  B23K2103/30 ,  B23K2103/42 ,  B23K2103/50 ,  C03C15/00 ,  C03C23/0025 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/742 ,  H01L2224/75 ,  H01L2224/75745 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/07802 ,  H05K3/0029 ,  H05K3/3478 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/082 ,  H01L2924/00 ,  H01L2224/05599

摘要： A method of forming bumps onto a chip having electrodes. The method includes the use of a template having through-holes arranged in correspondence to the electrodes of the chip. The template holds conductive balls to be formed into bumps to the template at the through-holes by vacuum suction. The through-holes of the template are formed by a laser, by supporting a glass plate on a support table having cavities and irradiating the plate with laser beams at the position of the cavities.

摘要翻译： 在具有电极的芯片上形成凸块的方法。 该方法包括使用具有对应于芯片的电极布置的通孔的模板。 该模板通过真空抽吸保持在通孔处形成与模板的凸起的导电球。 模板的通孔由激光器形成，通过将玻璃板支撑在具有空腔的支撑台上，并且在空腔的位置处用激光束照射该板。

公开(公告)号：US20080218349A1

公开(公告)日：2008-09-11

申请号：US12074057

申请日：2008-02-29

申请人： Tomohiko Maeda ,  Kazuo Sato ,  Yoshitaka Muraoka ,  Hidehiko Fuchida ,  Shuko Saito

发明人： Tomohiko Maeda ,  Kazuo Sato ,  Yoshitaka Muraoka ,  Hidehiko Fuchida ,  Shuko Saito

IPC分类号： G08B13/14 ,  H04Q5/22

CPC分类号： G05B19/4183 ,  G05B2219/31296 ,  G05B2219/31322 ,  Y02P90/10

摘要： In an RFID system comprising a detection unit for detecting an RFID tag and a control unit for exercising the control concerning the RFID tag, a determination unit determines whether to access a second area of an RFID tag comprising storage area, comprising of a first area for storing ID information and the second area for storing command information. An extraction unit extracts command information from the second area when it is determined to access the second area. An execution unit performs a process corresponding to the command information extracted by the extraction unit.

摘要翻译： 在包括用于检测RFID标签的检测单元和用于执行关于RFID标签的控制的控制单元的RFID系统中，确定单元确定是否访问包括存储区域的RFID标签的第二区域，所述RFID标签包括第一区域， 存储ID信息和用于存储命令信息的第二区域。 当确定访问第二区域时，提取单元从第二区域提取命令信息。 执行单元执行与由提取单元提取的命令信息相对应的处理。

公开(公告)号：US20080100444A1

公开(公告)日：2008-05-01

申请号：US11848998

申请日：2007-08-31

申请人： Kazuo SATO ,  Tomohiko Maeda ,  Yoshitaka Muraoka ,  Hidehiko Fuchida ,  Shuko Saito

发明人： Kazuo SATO ,  Tomohiko Maeda ,  Yoshitaka Muraoka ,  Hidehiko Fuchida ,  Shuko Saito

IPC分类号： G08B13/14

CPC分类号： G06Q10/08 ,  G06Q10/06 ,  Y02P90/10 ,  Y02P90/14 ,  Y02P90/18 ,  Y02P90/185

摘要： This system controls communication between a management system for managing the work process of a product using ID of an RF-ID tag and plural radio communication units each for radio communicating with an RF-ID tag provided associated with one stage of the work process. The system comprises a network state monitor unit monitoring the state of a network, a determination unit determining, based on the monitored state, which of the non-network mode or the network mode should be adopted, a control unit controlling the radio communication unit having read the ID to write, into the RF-ID tag, additional information corresponding to a stage corresponding to the radio communication unit when the non-network mode is adopted and transmitting the additional information to the management system when the network mode is adopted and an information collecting unit reading ID and the additional information from the RF-ID tag.

摘要翻译： 该系统控制用于使用RF-ID标签的ID管理产品的工作处理的管理系统与各个无线电通信单元之间的通信，每个无线电通信单元用于与提供与工作过程的一个阶段相关联的RF-ID标签进行无线电通信。 该系统包括监视网络的状态的网络状态监视单元，确定单元基于所监视的状态来确定应采用非网络模式或网络模式中的哪一种，控制单元，其控制无线电通信单元具有 当采用非网络模式时，读取要写入RF-ID标签的对应于与无线电通信单元相对应的阶段的附加信息，并且当采用网络模式时将附加信息发送到管理系统，并且 信息收集单元读取ID和来自RF-ID标签的附加信息。

公开(公告)号：US08274367B2

公开(公告)日：2012-09-25

申请号：US12074057

申请日：2008-02-29

申请人： Tomohiko Maeda ,  Kazuo Sato ,  Yoshitaka Muraoka ,  Hidehiko Fuchida ,  Shuko Saito

发明人： Tomohiko Maeda ,  Kazuo Sato ,  Yoshitaka Muraoka ,  Hidehiko Fuchida ,  Shuko Saito

IPC分类号： H04Q5/22

CPC分类号： G05B19/4183 ,  G05B2219/31296 ,  G05B2219/31322 ,  Y02P90/10

摘要： In an RFID system comprising a detection unit for detecting an RFID tag and a control unit for exercising the control concerning the RFID tag, a determination unit determines whether to access a second area of an RFID tag comprising storage area, comprising of a first area for storing ID information and the second area for storing command information. An extraction unit extracts command information from the second area when it is determined to access the second area. An execution unit performs a process corresponding to the command information extracted by the extraction unit.

摘要翻译： 在包括用于检测RFID标签的检测单元和用于执行关于RFID标签的控制的控制单元的RFID系统中，确定单元确定是否访问包括存储区域的RFID标签的第二区域，所述RFID标签包括第一区域， 存储ID信息和用于存储命令信息的第二区域。 当确定访问第二区域时，提取单元从第二区域提取命令信息。 执行单元执行与由提取单元提取的命令信息相对应的处理。

公开(公告)号：US07661598B2

公开(公告)日：2010-02-16

申请号：US11864746

申请日：2007-09-28

申请人： Yoshitaka Muraoka ,  Tomohiko Maeda ,  Kazuo Sato ,  Hidehiko Fuchida ,  Shuko Saito

发明人： Yoshitaka Muraoka ,  Tomohiko Maeda ,  Kazuo Sato ,  Hidehiko Fuchida ,  Shuko Saito

IPC分类号： G06K7/00

CPC分类号： G09F3/08

摘要： In a mechanism for attaching to a cart an RFID tag used for transmitting and receiving data to and from an RFID reader/writer, a holding pocket retains the RFID tag. The orientation of the pocket is kept constant in such a manner that a surface of the RFID tag from which data can be read highly accurately faces an antenna for the RFID reader/writer while keeping the distance between the RFID tag and the antenna within a certain range regardless of the transfer direction of the cart.

摘要翻译： 在用于将RFID标签用于向RFID读取器/写入器发送和接收数据的RFID标签的附接机构中，保持口保持RFID标签。 袋的取向保持恒定，使得可以高精度地读取数据的RFID标签的表面高度面对用于RFID读取器/写入器的天线，同时将RFID标签和天线之间的距离保持在一定范围内 范围，而不考虑推车的传送方向。