Invention Grant
- Patent Title: Electronic components incorporating ceramic-metal composites
- Patent Title (中): 包含陶瓷 - 金属复合材料的电子元件
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Application No.: US08820164Application Date: 1997-03-19
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Publication No.: US06346317B1Publication Date: 2002-02-12
- Inventor: Marcus A. Ritland , Dennis W. Readey , Jack D. Sibold , James E. Stephan
- Applicant: Marcus A. Ritland , Dennis W. Readey , Jack D. Sibold , James E. Stephan
- Main IPC: B22F300
- IPC: B22F300
Abstract:
The present invention relates to electronic components and in particular relates to ceramic-based electronic components wherein a portion of the component comprises a metal-infiltrated ceramic. In a preferred embodiment, the metal-infiltrated ceramic comprises copper metal.
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